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專任教師
劉禹辰Yu-chen Liu
職  稱
助理教授
學  歷
國立成功大學材料科學及工程學系博士
電  話
教授室(62152)、實驗室(62159-81)
研 究 室
教授室(91503)、實驗室(91811室)
網  頁
專  長
機器學習應用於材料科學、計算相圖、材料相平衡、材料設計、電流輔助加工、電遷移效應、同步輻射X光


簡要經歷

Assistant Professor (2023/02-)

  • Department of Mechanical Engineering, National Cheng Kung University

Project Assistant Professor (2021/08-2023/01)

  • Department of Materials Science and Engineering, National Cheng Kung University

Guest Editor

  • Crystals (ISSN 2073-4352) (2022-2023)

Member of Alloy Phase Committee (2020-now)

  • The Minerals, Metals & Materials Society (TMS), USA

Symposium organizer

  • Leading organizer:  The Minerals, Metals & Materials Society Annual meeting (TMS), USA (2024-)
  •  Co-organizer: The Minerals, Metals & Materials Society Annual meeting (TMS), USA (2020-2023)

Assistant Research Fellow (2020-2021)

  • Hierarchical Green-Energy Materials Research Center, National Cheng Kung University

Visiting Scholar

  • Dept. MS&E at University of Wisconsin-Madison, USA (2018-2019)
  • Institute of Scientific and Industrial Research at Osaka University, Japan (2015)
學術專長
  1. 機器學習應用於材料科學
  2. 計算相圖
  3. 材料相平衡
  4. 材料設計
  5. 電流輔助加工
  6. 同步輻射X光 
研究領域
  1. 低溫銲料
  2. 高溫銲料
  3. 氫能冶練
  4. 高爐煉鐵
主要授課課程
  1. 機械製造
期刊論文
  1. S.-Y. Yen, Y.-C. Liu, S.-h. Chu, C.-w. Chang, S.-k. Lin, and M.-H. Tsai, "B2-strengthened Al-Co-Cr-Fe-Ni high entropy alloy with high ductility", Materials Letter, 325, 132828 (2022) (#IF = 3.574, Rank: 57/161 = 35% in Physics, Applied). 

  2. C.-H. Yang, Y.-C. LiuS.-k. Lin, Y. Hirata and H. Nishikawa"High-strength Sn-Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modeling", Science and Technology of Welding and Joining, (2022) (#IF = 4.564, Rank:10/80 = 12.5% in METALLURGY & METALLURGICAL ENGINEERING). 

  3. W.-Y. Huang, Y.-C. LiuS.-k. Lin, and W.-H. Chen, Computational thermodynamics-assisted design of nitrate-based phase change materials f0R waste heat recovery”, International Journal of Energy Research, 2022; 1- 10 (2022) (#IF = 5.164, Rank:1/34 = 3% in Nuclear Science & Technology). 

  4. Y.-C. Liu, H. Wu, T. Mayeshiba, B. Afflerbach, R. Jacobs, J. Perry, J. Ge0Rge, J. C0Rdell, J. Xia, H. Yuan, A. L0Renson, H. Wu, M. Parker, F. Doshi, A. Politowicz, L. Xiao, D. M0Rgan, P. Wells, N. Almirall, T. Yamamoto and G. R. Odette, “Machine Learning Predictions of Irradiation Embrittlement in React0R Pressure Vessel Steels”, npj Computational Materials, 8, 85 (2022) (#IF = 12.241, Rank:30/334 = 9% in MATERIALS SCIENCE, MULTIDISCIPLINARY). 

  5. Y.-C. Liu, T.-Y. Liu, T.-H. Huang, K.-C. Chiu, S.-k. Lin, "Expl0Ring dielectric constant and dissipation fact0R of LTCC using machine learning", Materials, 14(19), 5784 (2021) (Special Issue: Simulation and Reliability Assessment of Advanced Packaging) (#IF = 3.623, Rank: 17/80 = 21% in METALLURGY & METALLURGICAL ENGINEERING).

  6. Y.-C. Liu, S.-Y. Yen, S.-H. Chu, S.-k. Lin, and M.-H. Tsai, "Mechanical and thermodynamic data-driven design of Al-Co-Cr-Fe-Ni multi-principal element alloys", Materials Today Communications, Vol. 26, 102096, (2021) (#IF=3.383, Rank: 165/333 = 50% in MATERIALS SCIENCE, MULTIDISCIPLINARY).

  7. Y.-C. Liu, S.-K. Lin, and S.-J. Chiu, “On the Schmid's Law f0R the electric current-induced def0Rmation: An in situ EBSD study”, International Journal of Mechanical Sciences, 168, 105295 (2020) (IF = 5.329, Rank:12/135 = 9% in MECHANICS -- SCIE).

  8. T.-L. Yang, Y.-C. Liu, C.-H. Yang, Y.-K. Kao, and S.-K. Lin, “F0Rmation of diffusion barrier-like intermetallic compound to suppress the f0Rmation of micro-voids at the Sn-0.7Cu/Cu interface by optimal Ga additions”, JOM, (2020) (IF = 2.471, Rank: 17/90 = 19% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).

  9. Y.-C. Liu, S.-K. Lin, H. Zhang, C. Chen, S. Nagao, and K. Suganuma, "Reactive wafer bonding with nanoscale Ag/Cu multilayers”, Scripta Materialia, 184, 1-5 (2020) (IF = 5.611, Rank: 5/80 = 6% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).

  10. G.-L. Ou, Y.-C. Liu, S.-Y. Yen, H.-Y. Wang, Y.-H. Su, M.-J Lu, and S.-K. Lin, "Reactivity and thermo-physical properties of MnO-modified CaO-Al2O3-based mold fluxes f0R advanced high-strength steels", Journal of Materials Research and Technology, (2020) (IF=5.039, Rank: 9/80 = 11% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).

  11. 劉禹辰、楊智涵、顏紹宇、林士剛, "計算相圖(CALPHAD)在材料製程上的應用", Chemical Engineering (The Taiwan I. Ch. E.) Vol.67, No. 6, DEC. 2020. (110年台灣化學工程協會化工傑作獎)

  12. Y.-C. Liu, B. Afflerbach, R. Jacobs, S.-K. Lin and D. M0Rgan, “Expl0Ring effective charge in electromigration using machine learning”, MRS Communications, 1-9 (2019) (Special Issue Research Letter: Artificial Intelligence [by invitation only]) (IF = 1.997, Rank: 197/314 = 63% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE).

  13. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, and S.-K. Lin, “Electromigration effect upon single- and two-phase Ag-Cu alloy strips: an in situ study”, Scripta Materialia, 173, 134-138 (2019) (IF = 5.079, Rank:6/79 = 8% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).

  14. Y.-C. Liu, and S.-K. Lin, “A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on Effect of Electric Current upon Alloy Phase Stability”, JOM, 71(9), 3094-3106 (2019) P.1-13 (IF=2.029, Rank: 23/79 = 29% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).

  15. J.-S. Huang, C.-L. Huang, Y.-C. Liu, S.-K. Lin, T.-S. Chan and H.-W. Tu, "Ab-initio-aided sensitizer design f0R Mn4+-activated Mg2TiO4 as an ultra-bright flu0Ride-free red emitting phosph0R", Chemistry of Materials 30 (5), 1769-1775 (2018) (IF = 10.159, Rank: 22/293 = 8% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE).

  16. S.-K. Lin, Y.-C. Liu, S.-J. Chiu, Y.-T. Liu, and H.-Y. Lee, "The electromigration effect revisited: non-unif0Rm local tensile stress-driven diffusion", Scientific Rep0Rts 7, 3082 (2017) (IF = 4.122, Rank: 12/64 = 19% in MULTIDISCIPLINARY SCIENCES -- SCIE).

  17. S.-K. Lin, M.-J. Wang, C.-Y. Yeh, H.-M. Chang, Y.-C. Liu, “High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy”, Journal of Alloys and Compounds, 702, 561–567 (2017) (IF= 3.779, Rank: 4/75 = 5% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).

  18. S.-K. Lin, S. Nagao, E. Yokoi, C. Oh, H. Zhang, Y.-C. Liu, S.-g. Lin & K. Suganuma, “Nano-volcanic Eruption of Silver”, Scientific Rep0Rts 6, 34769 (2016) (IF = 4.259, Rank: 10/64 = 16% in MULTIDISCIPLINARY SCIENCES -- SCIE).

  19. S.-K. Lin, H.-M. Chang, C.-L. Cho, Y.-C. Liu and Y.-K. Kuo, "F0Rmation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy f0R three-dimensional integrated circuits", Electronic Materials Letters, 11, 687-694 (2015) (IF =2.057, Rank: 103/271 = 50% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE).

  20. S.-K. Lin, C.-K. Yeh, W. Xie, Y.-C. Liu, and M. Yoshimura, "Ab initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressing", Scientific Rep0Rts 3, 2731 (2013) (IF = 5.078, Rank: 5/55 = 9% in MULTIDISCIPLINARY SCIENCES -- SCIE).

專利及技術移轉
  1. 林士剛、劉禹辰、林冠斈、陳昱清。載具結構材料強化系統及包含其的載具。中華民國專利號I742930。經濟部智慧財產局。(2021/10/11)

  2. 林士剛、劉禹辰、林冠斈、陳昱清。⾞両構造材料強化システム及びそれを含む⾞両日本特願2020-211516日本特許廳。(令和 4年 2月17日