Assistant Professor (2023/02-)
Project Assistant Professor (2021/08-2023/01)
Guest Editor
Member of Alloy Phase Committee (2020-now)
Symposium organizer
Assistant Research Fellow (2020-2021)
Visiting Scholar
S.-Y. Yen, Y.-C. Liu, S.-h. Chu, C.-w. Chang, S.-k. Lin, and M.-H. Tsai, "B2-strengthened Al-Co-Cr-Fe-Ni high entropy alloy with high ductility", Materials Letter, 325, 132828 (2022) (#IF = 3.574, Rank: 57/161 = 35% in Physics, Applied).
C.-H. Yang, Y.-C. Liu, S.-k. Lin, Y. Hirata and H. Nishikawa, "High-strength Sn-Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modeling", Science and Technology of Welding and Joining, (2022) (#IF = 4.564, Rank:10/80 = 12.5% in METALLURGY & METALLURGICAL ENGINEERING).
W.-Y. Huang, Y.-C. Liu, S.-k. Lin, and W.-H. Chen, “Computational thermodynamics-assisted design of nitrate-based phase change materials f0R waste heat recovery”, International Journal of Energy Research, 2022; 1- 10 (2022) (#IF = 5.164, Rank:1/34 = 3% in Nuclear Science & Technology).
Y.-C. Liu, H. Wu, T. Mayeshiba, B. Afflerbach, R. Jacobs, J. Perry, J. Ge0Rge, J. C0Rdell, J. Xia, H. Yuan, A. L0Renson, H. Wu, M. Parker, F. Doshi, A. Politowicz, L. Xiao, D. M0Rgan, P. Wells, N. Almirall, T. Yamamoto and G. R. Odette, “Machine Learning Predictions of Irradiation Embrittlement in React0R Pressure Vessel Steels”, npj Computational Materials, 8, 85 (2022) (#IF = 12.241, Rank:30/334 = 9% in MATERIALS SCIENCE, MULTIDISCIPLINARY).
Y.-C. Liu, T.-Y. Liu, T.-H. Huang, K.-C. Chiu, S.-k. Lin, "Expl0Ring dielectric constant and dissipation fact0R of LTCC using machine learning", Materials, 14(19), 5784 (2021) (Special Issue: Simulation and Reliability Assessment of Advanced Packaging) (#IF = 3.623, Rank: 17/80 = 21% in METALLURGY & METALLURGICAL ENGINEERING).
Y.-C. Liu, S.-Y. Yen, S.-H. Chu, S.-k. Lin, and M.-H. Tsai, "Mechanical and thermodynamic data-driven design of Al-Co-Cr-Fe-Ni multi-principal element alloys", Materials Today Communications, Vol. 26, 102096, (2021) (#IF=3.383, Rank: 165/333 = 50% in MATERIALS SCIENCE, MULTIDISCIPLINARY).
Y.-C. Liu, S.-K. Lin, and S.-J. Chiu, “On the Schmid's Law f0R the electric current-induced def0Rmation: An in situ EBSD study”, International Journal of Mechanical Sciences, 168, 105295 (2020) (IF = 5.329, Rank:12/135 = 9% in MECHANICS -- SCIE).
T.-L. Yang, Y.-C. Liu, C.-H. Yang, Y.-K. Kao, and S.-K. Lin, “F0Rmation of diffusion barrier-like intermetallic compound to suppress the f0Rmation of micro-voids at the Sn-0.7Cu/Cu interface by optimal Ga additions”, JOM, (2020) (IF = 2.471, Rank: 17/90 = 19% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).
Y.-C. Liu, S.-K. Lin, H. Zhang, C. Chen, S. Nagao, and K. Suganuma, "Reactive wafer bonding with nanoscale Ag/Cu multilayers”, Scripta Materialia, 184, 1-5 (2020) (IF = 5.611, Rank: 5/80 = 6% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).
G.-L. Ou, Y.-C. Liu, S.-Y. Yen, H.-Y. Wang, Y.-H. Su, M.-J Lu, and S.-K. Lin, "Reactivity and thermo-physical properties of MnO-modified CaO-Al2O3-based mold fluxes f0R advanced high-strength steels", Journal of Materials Research and Technology, (2020) (IF=5.039, Rank: 9/80 = 11% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).
劉禹辰、楊智涵、顏紹宇、林士剛, "計算相圖(CALPHAD)在材料製程上的應用", Chemical Engineering (The Taiwan I. Ch. E.) Vol.67, No. 6, DEC. 2020.
Y.-C. Liu, B. Afflerbach, R. Jacobs, S.-K. Lin and D. M0Rgan, “Expl0Ring effective charge in electromigration using machine learning”, MRS Communications, 1-9 (2019) (Special Issue Research Letter: Artificial Intelligence [by invitation only]) (IF = 1.997, Rank: 197/314 = 63% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE).
Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, and S.-K. Lin, “Electromigration effect upon single- and two-phase Ag-Cu alloy strips: an in situ study”, Scripta Materialia, 173, 134-138 (2019) (IF = 5.079, Rank:6/79 = 8% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).
Y.-C. Liu, and S.-K. Lin, “A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on Effect of Electric Current upon Alloy Phase Stability”, JOM, 71(9), 3094-3106 (2019) P.1-13 (IF=2.029, Rank: 23/79 = 29% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).
J.-S. Huang, C.-L. Huang, Y.-C. Liu, S.-K. Lin, T.-S. Chan and H.-W. Tu, "Ab-initio-aided sensitizer design f0R Mn4+-activated Mg2TiO4 as an ultra-bright flu0Ride-free red emitting phosph0R", Chemistry of Materials 30 (5), 1769-1775 (2018) (IF = 10.159, Rank: 22/293 = 8% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE).
S.-K. Lin, Y.-C. Liu, S.-J. Chiu, Y.-T. Liu, and H.-Y. Lee, "The electromigration effect revisited: non-unif0Rm local tensile stress-driven diffusion", Scientific Rep0Rts 7, 3082 (2017) (IF = 4.122, Rank: 12/64 = 19% in MULTIDISCIPLINARY SCIENCES -- SCIE).
S.-K. Lin, M.-J. Wang, C.-Y. Yeh, H.-M. Chang, Y.-C. Liu, “High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy”, Journal of Alloys and Compounds, 702, 561–567 (2017) (IF= 3.779, Rank: 4/75 = 5% in METALLURGY & METALLURGICAL ENGINEERING -- SCIE).
S.-K. Lin, S. Nagao, E. Yokoi, C. Oh, H. Zhang, Y.-C. Liu, S.-g. Lin & K. Suganuma, “Nano-volcanic Eruption of Silver”, Scientific Rep0Rts 6, 34769 (2016) (IF = 4.259, Rank: 10/64 = 16% in MULTIDISCIPLINARY SCIENCES -- SCIE).
S.-K. Lin, H.-M. Chang, C.-L. Cho, Y.-C. Liu and Y.-K. Kuo, "F0Rmation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy f0R three-dimensional integrated circuits", Electronic Materials Letters, 11, 687-694 (2015) (IF =2.057, Rank: 103/271 = 50% in MATERIALS SCIENCE, MULTIDISCIPLINARY -- SCIE).
S.-K. Lin, C.-K. Yeh, W. Xie, Y.-C. Liu, and M. Yoshimura, "Ab initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressing", Scientific Rep0Rts 3, 2731 (2013) (IF = 5.078, Rank: 5/55 = 9% in MULTIDISCIPLINARY SCIENCES -- SCIE).
林士剛、劉禹辰、林冠斈、陳昱清。載具結構材料強化系統及包含其的載具。中華民國專利號I742930。經濟部智慧財產局。(2021/10/11)
林士剛、劉禹辰、林冠斈、陳昱清。⾞両構造材料強化システム及びそれを含む⾞両。日本特願2020-211516。日本特許廳。(令和 4年 2月17日)