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專任教師
陳國聲Kuo-Shen Chen
職  稱
教授
學  歷
美國麻省理工學院機械系博士
電  話
教授室(62192)、實驗室(62272)
研 究 室
教授室(91710室)、實驗室(91A07室)
網  頁
專  長
結構振動控制、固力結構與材料機械性質、微機電系統設計分析、精密機械與機電整合
簡要經歷
BS. Power Mechanical Engineering, National Tsing-Hua University (1989)
MS. Mechanical Engineering, Massachusetts Institute of Technology, USA (1995)
Ph.D. Mechanical Engineering, Massachusetts Institute of Technology, USA (1999)
Post Doct0Ral researcher, Aeronautics and Astronautics Department, Massachusetts Institute of Technology, USA (1999)
2nd Lieutenant, Amry arm0R division (1990-92)
Research assistant, institute of inf0Rmaton science, Academia Sinica (1992-93)

Assistant Profess0R, NCKU ME (1999-2003)
Associate Profess0R, NCKU ME (2003-2007)
Profess0R, NCKU ME (2007 -) 
Visiting profess0R, MIT (2010-11)
Dupty head, ME, NCKU (2017-2020)
學術專長
Micro / Nano mechnaics and simulation
Material characterization
Precision design and motion control
Vibration engineering
Intelligent manufacturing
Mobile robots and vehicles
研究領域
Electronic packaging
Status monit0Ring and diagnosis
Mobile robots and indo0R localization
Precsion motion control and vibration suppression
Testing system designs (material characterization, ABS)
主要授課課程
Engineering mechanics
Mechanical Vibrations
Measurement and Instrumentations
Electric circuits
Advanced mechanics of Mechanics
Analytical Dynamics
System Dynamics and Modeling
Semiconduct0R processing
Advanced semiconduct0R processing equipment
Advanced vibration mechanics
Introduction to Microelectromechanical Systems
期刊論文
  1. Refereed Journal Paper
 
[1]         S. M. Spearing and K-S Chen, 1997/08, "Micro Gas Turbine Engine Materials and Structures,"    Ceramic Engineering and Science Proceedings, Vol. 18(4), pp. 11-18. 
[2]         N. Hagood IV, D. Roberts, M. Schmidt, S. Spearing, K. Breuer, R. Mlcak, J. Carretero, F. Ganji, H. Li, K-S Chen, Y. Su, and S. Pulitzer "Microhydraulic transducer technology f0R actuation and power generation", Proceedings of SPIE - The International Society f0R Optical Engineering, v 3985, p 680-688, 2000.
[3]        Kuo-Shen Chen*, A. A. Ayon, S. M. Spearing, 2000/06, "Controlling and Testing the Fracture Strength of Silicon on the Mesoscale," J. American Ceramic Society, Vol. 83, no. 6, pp. 1476-1484.
[4]        Kuo-Shen Chen*, S. Mark Spearing, Noel N. Nemeth, 2001/04, “Structural Design of a Silicon Micro Turbo Generat0R”, AIAA Journal, Vol. 39, No. 4, pp. 720-728.
[5]        X. Zhang, K-S Chen, R. Ghodssi, A. A. Ayon, and S. M. Spearing, 2001/07, “Residual Stress and Fracture in Thick Tetraethyl0Rthosilicate (TEOS) and Silane-Based PECVD Oxide Films, Sens0Rs and Actuat0Rs (A), Vol. 91. pp. 379-386.
[6]        Y. N. Su,K-S Chen, D. C. Roberts, S. M. Spearing, 2001/11, “Large Deflection Analysis of Thin Annular Plates,” J. Micromechanics and Microengineering, Vol. 11, pp. 645-654.
[7]        K-S Chen*, A. A. Ayon, X. Zhang, S. M. Spearing, 2002/06, "Effect of Process Parameters on the Surface M0Rphology and Mechanical Perf0Rmance of Silicon After Deep Reactive Ion Etching (DRIE)”, ASME/IEEE J. Microelectromechanical Systems, V. 11, pp. 264-275.
[8]        K-S Chen*, D. L. Trumper, S. T. Smith, 2002/10, “Design and Control of an Electromagnetically Driven X-Y-qStage,” Precision Engineering- Journal of the International Societies f0R Precision Engineering and Nanotechnology, Vol. 26, pp.355-369, 2002.
[9]        K-S Chen*, S-Y Lin, and J-Y Chen, 2002/07, “Fracture Analysis of Thick PECVD Oxide Films f0R Improving Structural Integrity of Power MEMS,"J. Micromechanics and Microengineering,V. 12, pp. 714-722.
[10]      K-S Chen* and K-S Ou, 2002/11, "Modification of Curvature-Based Thin Film Residual Stresses Measurement f0R MEMS Applications",J. Micromechanics & Microengineering, V.12, pp. 917-924.
[11]      K-S Chen*, J-J Zheng, and H-M Yeh, 2002/12 “Development of MEMS Fabrication Emulat0R By Solid Modeling Technology,” J. Chinese Society of Mechanical Engineering,, V. 23, pp. 525-532.
[12]      X. Zhang, K-S Chen, S. M. Spearing, 2003/01, "Thermal Mechanical Behavi0R of Thick PECVD Oxide Films f0R Power MEMS Applications," Sens0Rs and Actuat0Rs (A), Vol. 103, pp. 263-270.
[13]       K-S Chen*, X. Zhang, and S-Y Lin, 2003/07, “Intrinsic Stress Generation and Relaxation of Plasma Enhanced Chemical Vap0R Deposited Oxide During Deposition and Subsequent Thermal Cycling,”Thin Solid Films, V434, pp.190-202.
[14]       K-S Chen* and C-C Ho, 2004/01 “Electromagnets Calibration Utilizing the Pull-In Instability,” Precision Engineering- Journal of the International Societies f0R Precision Engineering and Nanotechnology ,Vol. 28,1, 106-115.
[15]      K-S Chen*, J-F Yin, T-S Yang, and K-S Ou, 2004/02 “Vibration Suppression of a Cantilever Beam by Input Shaping,” J. Chinese Society of Mechanical Engineering, Vol. 25, pp. 59-67 (EI) (NSC90-2212-E-006-059, NSC92-2212-E-006-122)
[16]      K-S Chen*, L-M Li, and K-S Ou, 2004/02 “Accuracy Assessment of Simplified Electromechanical Coupling Solvers f0R MEMS Applications” J. Micromechanics & Microengineering, V. 14, pp. 159-169.
[17]      T-S Yang, N-T Hsu, K-S Chen, and F-H Ko, 2004/04 “Analysis of Experimental Data f0R Metallic Impurity Out-Diffusion FR0M Deep Ultraviolet Phot0Resist,” J. Electrochemistry Society, Vol. 151, No. 2, pp. G149-G154. 
[18]      K-S Chen*and K-S Ou, 2004/04 "Equivalent Strengths f0R Reliability Assessment of MEMS structures," Sens0Rs & Actuat0Rs A, Vol. 112, pp. 163-174, 2004.
[19]      J-K Chen, I-K Lin, F-H Ko, C-F Huang, K-S Chen and F-C Chang, 2004/09 “Behavi0R and Surface Energies of Polybenzoxazines f0Rmed by Polymerization with Argon, Oxygen, and Hydrogen Plasmas,” Journal of Polymer Science B: Polymer Physics,vol. 42, pp. 4063-4074, 2004.
[20]      K-S Chen*, T. Y. Chen, J-C Chuang, and I-K Lin, 2004/09 "Full- Field Wafer Level Thin Film Stress Measurement By Phase-Stepping Shadow M0Rie,"IEEE Transaction of Component and Packaging Technology, Vol. 27, 3, pp. 594-601, 2004.
[21]      K-S Chen*, J-F Yin, T-S Yang, K-S Ou, 2004/09 "Residual Vibration Suppression of a Cantilever Beam Using Command Shaping Technology," Trans. Aeronautical and Astronautical Soc. ROC, Vol. 36, 3, pp. 249-257, 2004.
[22]       K-S Chen*, I-K Lin, and F-H Ko, 2005/10 “Fabrication of 3D Polymer Microstructures Using Electron Beam Lithography and Nanoimprinting Technologies,” J. Micromechanics and Microengineering, Vol. 15, pp. 1894-1903, 2005.
[23]     T-S Yang, K-S Chen, C-C Lee, and J-F Yin, 2006/01 “Suppression of Motion-Induced Residual Vibration of a Cantilever Beam by Input Shaping,” J. Engineering Mathematics, V.54, pp.1-15, 2006.
[24]     Kuo-Shen Chen*, B0R-Zone Chen, and Chin-Chuang Huang, 2006/12 "Design and Control of a Piezoelectrical Driven Fatigue Testing System f0R Electronic Packaging Applications", IEEE Trans. Components and Packaging Technologies, Vol. 29, pp. 841-849, 2006.
[25]      K-S Chen*, T-S Yang, and J-F Yin, 2006/12 “Residual Vibration Suppression f0R Duffing Nonlinear Systems with Electromagnetically Actuation Using Nonlinear Command Shaping Techniques,” ASME J. Vibrations and Acoustics, Vol. 127, pp. 778-789, 2006.
[26]      K-S Chen* and R-F Hsu, 2007/03 "Evaluation of Environmental Effects on Mechanical Properties and Characterization of Creep Behavi0R of PMMA,"J. Chinese Institute of Engineering, Vol. 30, pp. 267-274, 2007.
[27]      T.-S. Yang, K.-S. Chen, C.-C. Lee and I. Hu, 2007/04 "Suppression of motion-induced residual longitudinal vibration of an elastic rod by input shaping," J. Eng. Mathematics, Vol. 57, pp. 365-379, 2007.
[28]      K-S Chen* and K-S Ou, 2007/05 "Development and Verification of 2D Dynamic Electromechanical Coupling Solver f0R Micro-Electrostatic-Actuat0R Applications," Sens0Rs & Actuat0Rs A Physical, Vol. 136, pp. 403-411.
[29]      K-S Chen* and K-S Ou, 2007/06 "Command Shaping Techniques f0R Electrostatic MEMS Actuation: Analysis and Simulation," IEEE J. Microelectromechanical Systems,Vol. 16, pp. 537-549, 2007.
[30]      H-M Yeh, K-S Chen*, and I-K Lin, 2007/06 "Development of 3D Electron Beam Lithography Fabrication Simulat0R," Tamkang Journal of Science and Engineering, Vol. 10, pp. 167-172, 2007.
[31]      K-S Ou, H-Y Yan, and K-S Chen*, 2007/05 “Mechanical Characterization of KMPR by Nanoindentation f0R MEMS Applications,"Strain, Vol.44, pp. 267-271, 2008.
[32]       K-S Chen* and H-M Yeh, "Development of Geometrical Based Fabrication Emulat0R f0R MEMS Micromachining and Excimer Laser Ablation," J. Chinese Institute of Engineers, Vol. 31, pp. 41-51, 2008.
[33]      H-Y Yan, K-S Ou, and K-S Chen*, "Mechanical Properties Measurement of PECVD Silicon Nitride after Rapid Thermal Annealing Using Nanoindentation Technique," Strain, Vol.44, pp. 259-266, 2008.
[34]       K-S Chen*, T-C Chen, and K-S Ou, "Development of Semi-Empirical F0Rmulation to Extracting Materials Proper Through Indentation Tests: Residual Stresses, Substrate Effect, and Creep," Thin Solid Films Vol. 516, pp. 1931-1940, 2008.
[35]       K-S Chen*, T-S Yang, K-S Ou, and J-F Yin, "Design of Command Shapers f0R Residual Vibration Suppression in Duffing Nonlinear Systems," Mechatronics, Vol. 19, pp. 184-198, 2009.
[36]       K-S Ou, K-S Chen*, T-S Yang, and S-Y Lee "A Command Shaping Approach to Enhance the Dynamic Perf0Rmance and Longevity of Contact Switches," Mechatronics,Vol. 19, pp. 375-389, 2009.
[37]       I-K Lin, Y-M Liao, Y. Lu, K-S Ou, K-S Chen, and X. Zhang, "Mechanical Behavi0R of Soft Microcantilever-based F0Rce Sens0Rs," Applied Physics Letter, Vol. 93, 251907, 2008.
[38]       T-S Yang, Y-C Wang, K-S Chen, Y-C Chen, and J-L Yan, "Optimization of Wafer-back Pressure Profile in Chemical Mechanical Planarization," J. Electrical Chemical Society, Vol. 155, H720-729, 2008.
[39]       K-S Chen*, H-M Yeh, J-L Yan, and Y-C Chen, "Finite-element analysis on wafer-level CMP contact stress: reinvestigated issues and the effects of se1ected process parameters," International J. Advanced Manufacturing Technology, Vol. 42, pp.1118-1130, 2009.
[40]       H-M Yeh and K-S Chen*, "Development of a Digital-Convolution-Based Process Emulat0R f0R Three-Dimensional Microstructure Fabrication Using Electron-Beam Lithography,"IEEE J. Industrial Electronics, Vol. 56, No. 4, pp. 926-936, April 2009.
[41]       I-K Lin, Y-M Liao, Y. Lu, K-S Ou, K-S Chen, and X. Zhang,"Elastic and Viscoelastic Characterization and Modeling of Polymer based Structures f0R Biological Applications," IEEE/ASME J. Microelectromechanical Systems, Vol. 18,pp. 1087-1099, 2009.
[42]       Tian-Shiang Yang, Ian Hu, Kuo-Shen Chen, Chia-Liang Liu, and Yao-Chen Wang, "Effects of Retaining Ring on Contact Stress Unif0Rmity in Chemical Mechanical Planarization,"Journal of the Chinese Society of Mechanical Engineers, Vol.30, No.5, pp.381~392 (2009).
[43]       K-S Chen*, K-S Ou, and Y-M Liao, "On the Influence of Roller Misalignments on the Web Behavi0R during Roll-to-Roll Processing" J. Chinese Institute of Engineers, Vol. 34, pp. 87-97, 2011
[44]       K-S Chen* and K-S Ou, “Suppression of Motion-Induced Vibration f0R Electromagnetically Actuated Flexible Structures Using Nonlinear Command Shaping Technique,” Journal of Vibration and Control, Vol. 16, pp. 1713-1734, 2010.
[45]       H-M Yeh and K-S Chen*, "Development of a Pad Conditioning Simulation Module with a Diamond Dresser f0R CMP Applications," International J. Advanced Manufacturing Technology,Vol. 50, pp.1-12, 2010.
[46]       K-S Ou, K-S Chen*, T-S Yang, and S-Y Lee, “Fast Positioning and Impact Minimizing of MEMS Devices by Suppression Motion-Induced Vibration by Command Shaping Method,” IEEE/ASME J. Microelctromechanical Systems, Vol. 20, pp. 128-129, 2011.
[47]       I-K Lin, P-H Wu, K-S Ou, K-S Chen*, and X. Zhang, "Mechanical property characterization of sputtered and plasma enhanced chemical deposition (PECVD) silicon nitride films after rapid thermal annealing" Sens0Rs and Actuat0Rs A: Physical, Vol. 117, pp. 117-126, 2011.
[48]       K-S Ou, K-S Chen*, T-S Yang, and S-Y Lee, “A Novel Semi-Analytical Approach f0R Micro Beams Subjected to Electrostatic Loads and Residual Stress Gradients,” IEEE/ASME J. Microelectromechanical Systems, Vol. 20, pp. 527-537, 2011.
[49]       C-X Dai and K-S Chen*, "Residual Vibration Suppression of Crane Movement by Input Shaping: Experimental Investigation and Finite Element Dynamics Simulations" Journal of Chinese Society of Mechanical Engineers, Vol. 34, pp. 497-506, 2013.
[50]       I. Hu, T-S Yang, and K-S Chen, “Synergetic effects of wafer rigidity and retaining-ring parameters on contact stress unif0Rmity in chemical mechanical planarization,” Int. J. Adv. Manuf. Technol, Vol. 56, pp.523-538, 2011.
[51]       W-C Lin, C-X Dai, D-L Deng, K-S Ou, and K-S Chen*,”Perf0Rmance Evaluation of Drift-Free Integration f0R Navigation and Velocity Feedback Applications,” J. Chinese Institute of Engineers, Vol. 35, pp. 767-778, 2012.
[52]       M-H Chen, Y-D Fu, K-S Ou, and K-S Chen*, "Development of Navigation Schemes f0R Mobile Robot Group Leading Biomimetic Applications", International Journal of Automation and Smart Technology, Vol. 2, no. 1, pp. 29-41, 2012.
[53]       C-H Pi, I-F Tsai, K-S Ou, and K-S Chen*, "A One-Dimensional Touch Panel Based on Strain Sensing," Mechatronics, Vol. 22, pp. 802-810, Apr. 2012.
[54]       B-W Chen, D. Gu, K-S Ou, M-H Chen, and K-S Chen*,"IR Indo0R Localization and Motion Control in Smart Living Space Applications Based on Wiimote Technology: A Preliminary Demonstration,"J. Chinese Society of Mechanical Engineers,Vol. 35, pp. 187-196, 2014.
[55]       J. W. Lee, K-S Chen, and Y. H. Liu, “Design, Analysis, and Control of a Cascaded Piezoelectric Actuated Two-Degrees-of-Freedom Precision Stage”International J. of Earth Science, Vol. 6, pp. 856-861, 2013.
[56]       K-S Ou and K-S Chen*, “Pull-in Voltage Estimation of Micro Cantilever Beams with Effects of Residual Stress Gradients and Capacitance Fringing,” IEEE/ASME Trans. Device and Materials Reliability, Vol. 14, pp. 577-579, March 2014.
[57]       S. Věchet, K-S Chen, J. Krejsa, “Navigation Method f0R Autonomous Robots in a Dynamic Indo0R Environment”, International Journal of Automation and Smart Technology, Vol. 3, no. 4, pp. 273-277, Dec, 2013.
[58]       Z. K. Huang and K-S Chen*, “Nanoindentation Fracture and Fatigue Characterization of PECVD Silicon Nitride Films Subjected to Rapid Thermal Annealing,” Sens0Rs and Actuat0Rs, A, Physical, Vol. 207, pp. 49-60, 2014.
[59]       W. C. Wang, J. W. Lee, K-S Chen*, and W-H Liu, “Design and vibration control of a notch-based compliant stage f0R display panel inspection applications,”Journal of Sound and Vibration, Vol. 333, pp. 2701-2718, May, 2014.
[60]       C-H Pi and K-S Chen*, “A Strain-Sensing Based Scheme f0R Indo0R Localization: Analysis, Alg0Rithm, and Demonstration,” Measurement, Vol. 52, pp. 224-235, May 2014.
[61]       S. L. Wu and K-S Chen*,“Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods,” Microsystem Technologies, Vol. 21, pp. 1879-1892, Sep. 2015.
[62]       D. Gu and K-S Chen*, “Design and Perf0Rmance Evaluation of Wiimote-Based Two-Dimensional Indo0R Localization Systems f0R Intelligent Living Applications”Measurement, Vol. 66, pp. 95-108, 2015.
[63]       K-S Chen* and R-C Hong, On the Stiffness of Elastomer Bearings f0R Precision Machine Design,” JOURNAL OF THE CHINESE SOCIETY OF MECHANICAL ENGINEERS 37.6 (2016): 533-546.
[64]       H. H. Huang and K-S Chen*, “DESIGN, ANALYSIS, AND EXPERIMENTAL STUDIES OF A NOVEL PVDF-BASED PIEZOELECTRIC ENERGY HARVESTER WITH BEATING MECHANISMS,”Sens0Rs and Actuat0Rs A, Physical, Vol. 238, pp. 317-328, 2016. (2次)
[65]       K-S Ou and K-S Chen*, “Developing Electromechanical Coupling Macro Models f0R Improving Dynamic Responses of MEMS Elastic Structures with Command Shaping Techniques,” IEEE Trans. Device and Materials Reliability, Vol. 16, pp. 123-131, 2016.
[66]       J. W. Lee, K-S Chen*, and Y-C Li “Design and Control of a Cascaded Piezoelectric Actuated Two-Degrees-of-Freedom Positioning Stage f0R LCD Array Repair Applications,”Precision Engineering, Vol. 45, pp. 374-386, 2016.
[67]       T. C. Chiu, C-A Hua, C-H Wang, K-S Chen, T-S Yang, C-D Wen, C-H Li, M-C Lin, C-J Huang, and K-T Chen, “On the Mechanics of Laser Peeling f0R Ultra-Thin Glasses,” Engineering Fracture Mechanics, Vol. 163, pp. 236-247, 2016.
[68]       Y-C Deng and K-S Chen*, “Analysis, Design, and Control of a Novel Elastomeric Bearing Positioning Stage,” MDPI Inventions, Vol.1, pp. 17-28, 2016.
[69]       C-H Chuang, K-S Chen*, Y-K Chang, and C-C Chen, “Buckling and Postbuckling Failure Analyses on a Rectangular Membrane f0R Touch Panel Applications,” IEEE Trans. Device and Materials Reliability, Vol. 17, pp. 204-212, March, 2017.
[70]       K-S Chen*, T-S Yang, R-C Hong, T-C Chiu, and M-C Lin, “Thermo-Mechanical Analysis of Laser Peeling of Ultrathin Glass f0R Removing Edge Flaws in Web Processing Applications,” Microsystem Technologies, Vol. 24, pp. 397-409, 2018.
[71]       C-H Cheng, M-F Wu, S-H Guo, K-S Chen*, “Realization and Perf0Rmance Assessment of a F0Rce-Sensing Based Smart Flo0R Panel f0R Indo0R Localization Applications,” Sens0Rs and Actuat0Rs, A: Physical, Vol. 285, p. 468-481, 2019.
[72]       Y-T Fu and K-S Chen*,” An Indo0R Localization Scheme by Integrating Wiimote and a IR-LED Array f0R Mobile Robot Navigations,” Journal of Chinese Society of Mechanical Engineers, Vol. 40, pp. 21-31, 2019.
[73]       C.-F. Chuang, K.-S. Chen*, T.-C. Chiu, T.-S. Yang, M.-C. Lin, ”Crafting interi0R holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations,” Sens0Rs and Actuat0Rs, A: Physical, Vol. 301, 111723, 2020.
[74]       Y-K Chang, K-S Chen*, and C-C Chen, “Characterization and Image-Based Perf0Rmance Evaluation on the Longevity of LCDs Under High Temperature and Humid Environment,” IEEE Trans. Device and Materials Reliability, Vol. 20, pp. 42-50, 2020.
[75]       H-C Hsu, H-Y Chan, T-H Li, and K-S Chen*, “Development of General Wiimote 3D Localization Scheme and its Application on Robot Arm Attitude Detection,” Journal of the Institute of Industrial Applications Engineers, Vol. 8, pp. 8-15, 2020.
[76]       C-Y Yang, K-S Chen*, and T-S Yang, “Reconstituted Wafer Def0Rmation Analysis through Whole Process Emulation,” IEEE Trans. Device and Materials Reliability, Vol. 20, pp. 172-180, 2020.
[77]       W-J Chen and K-S Chen*, “Finite Element Based Input Shaping Design f0R Suppressing Motion-Induced Vibrations” Journal of Chinese Society of Mechanical Engineers, vol. 42, n1, pp 1-10. (2021)
[78]       K-S Chen*, Y-G Tsai, and T-H Yang, “Stress Analysis and Characterization of PECVD Oxide/Nitride Multi-Layered Films after Thermal Cycling,” IEEE Trans. Device and Materials Reliability (Accepted, Dec. 02, 2020)
[79]       T-H Li, K-S Chen*, S. Vechet, “Development and Demonstration of Indo0R Three-Dimensional Localization Using IR CMOS Sens0Rs f0R Mobile Manipulat0Rs,” Sens0Rs and Actuat0Rs A: Physical, Vol. 318, 112497, 2021.
[80]       J. M. Tsai, I. C. Sun, and K. S. Chen*, “Realization and Perf0Rmance Evaluation of a Machine Tool Vibration Monit0Ring Module by Multiple MEMS Accelerometer Integrations,” International J. Advanced Manufacturing Technology, Vol. 114, pp.465–479, 2021.


 
研討會論文
國際研討會論文

[A122] W-C Wu, K-S Chen etal, "Development of Artificial Neural Netw0Rk and Topology Reconstruction Schemes f0R Fan-Out Wafer Warpage Analysis," IEEE 71st Electronic Components and Technology Conference (ECTC 2021), Jun, 2021, San Diego, USA. 
[A121] K-S Chen et al, "Development of Semi-Analytical F0Rmulation f0R Asymmetric Warpage Prediction in Fan-out Reconstitution Process," 2021 International Conference on Electronics Packaging (ICEP 2021), May 12-14, Tokyo Japan. 

[A120] H-M Lin, J-J Wang, K-S Chen, "Prediction and Simulation f0R Turning Chatter Control by Spindle Speed Variation, " 9th IIAE International Conference on Industrial Application Engineering, (ICIAE2021), Kitakyushu, Japan, March 27, 2021.
[A119] T-H Hsueh, S-H Guo, S-H Hung, K-S Chen, M-C Tsai, "Perf0Rmance Benchmark Characterization and Braking Maneuverability Evaluation of Antilock Braking System with a Self-Developed Tester"  9th IIAE International Conference on Industrial Application Engineering, (ICIAE2021), Kitakyushu, Japan, March 27, 2021.
[A118] R-C Cheng, K-S Chen, Y-H Liu, L-K Chang, M-C Tsai,"Development of Autoencoder-Based Status Diagnosis Method f0R Ball Bearing Tribology Status Monit0Ring" 9th IIAE International Conference on Industrial Application Engineering, (ICIAE2021), Kitakyushu, Japan, March 27, 2021.
[A117Chen, C. W., Chang, L. K., Liao, Y. T., Chung C. H., Su, W. C., Chen, K. S., Tsai, M. C., "Tuning of Servo Drive Controller Based on Boosted Tree Model and Particle Swarm Optimization,"23rd International Conference on Electrical Machines and Systems, ICEMS 2020. (
[A116] Stanislav Vechet, Jiri Krejsa, Kuo-Shen Chen: “AGVs Mission Control Supp0Rt in Smart Fact0Ries by Decision Netw0Rks,” 19th Mechatronik 2020, Prague, Cezch Republic, Dec. 02-4, 2020.
[A115] Vojtěch Venglář, Jan Králík, Hong-Liang Chin, Kuo-Shen Chen: “Mesh Wi-Fi Infrastructure f0R Multi-agent Robotic System,” 19th Mechatronik 2020, Prague, Cezch Republic, Dec. 02-4, 2020.

[A114] D. R. Shen, H. L. Chin, C. H. Tu, J. S. Shih, V. Venglar, K. S. Chen, J. Krejsa, and S. Vechet, “Navigation and Task Planning of a Mobile Robot under ROS Environment: A Case Study Using Aut0Race Challenge”, 19th Mechatronik 2020, Prague, Cezch Republic, Dec. 02-4, 2020.  
[A113] C-A Chen, Y-C Chen, K-S Chen, and Y-H Liu, “Design, Analysis, and Control of a Stiffness-Tunable 3-DOF Rubber-Bearing Positioning Stage”8th IIAE International Conference on Industrial Application Engineering, (ICIAE2020), Matsue, Japan, March 26, 2020.
[A112] K-H Lee, K-S Chen, and Y-H Liu, “Design and Control of a Compliant Stage with Reconfigurable Dynamic Characteristics by Inc0Rp0Rated Rubber Shear Damper,” 8th IIAE International Conference on Industrial Application Engineering, (ICIAE2020), Matsue, Japan, March 26, 2020.
[A111] Y-H Huang, Y-H Liu, and K-S Chen, “Design of Digital Communication Process f0R Condition Monit0R Machine Tool”, 8th IIAE International Conference on Industrial Application Engineering, (ICIAE2020), Matsue, Japan, March 27, 2020.
[A110] J-H Wu, S-H Guo, K-S Chen, and M-C Tsai, “Design and Realization of a Perf0Rmance and Reliability Evaluation Module f0R Commercialized Anti-lock Braking Systems”, pp. 237-245, Proc. 13th Mechatronics 2019, Poland, Sep 16-18, 2019, Warsaw, Poland.
[A109] C-Y Yang, K-S Chen, T-S Yang, T-C Chiu, and C-J Ho, “Thermo-Mechanical Process Emulation and Sensitivity Analysis of Wafer Warpage after Reconstitution in Fan-out Packaging”, p03, Proc. International Conf. on Electronics Packaging (ICEP 2019), Niigata, Japan, April 17-20, 2019.
[A108] W-J Chen, K-S Chen, and M-C Tsai, “Finite Element Input Shaping Design f0R Vibration Suppression of Mechatronics Systems”, Proc. International Conf. on Mechatronics, Ilmenau, Germany Mar. 18-20, 2019.
[A107] S-H Guo, C-H Wu, and K-S Chen, “Design and Realization a Versatile Perf0Rmance Test Platf0Rm f0R Mot0Rcycle Anti-lock Braking System,” 7th IIAE International Conference on Industrial Application Engineering, (ICIAE2019), Kitakyushu, Japan, March 26-30, 2019.
[A106] I-C Sun, J-M Tsai, K-S Chen, Y-H Liu, T-S Yang, a nd M-C Tsai, “Design and Realization of a Sensing Module f0R Machine Tools Status Monit0Ring by Multiple MEMS Accelerometers Integration”,7th IIAE International Conference on Industrial Application Engineering, (ICIAE2019), Kitakyushu, Japan, March 26-30, 2019.
[A105] C-W Lee, Y-C Pei, K-S Chen, and S-Y Lee, “Application of Homography Transf0Rmation f0R Assisting Machine Vision in Automatic Guided Vehicles,” 7th IIAE International Conference on Industrial Application Engineering, (ICIAE2019), Kitakyushu, Japan, March 26-30, 2019.
[A104] S-C Hsu, T-H Li, H-Y Chan, and K-S Chen, ”General Dual Wiimote 3D Localization Scheme: Sensitivity Analysis and Its Application on Robot Arm Attitude Detection,” 7th IIAE International Conference on Industrial Application Engineering, (ICIAE2019), Kitakyushu, Japan, March 26-30, 2019.
[A103] S-C Chen, K-S Chen, and T-C Chiu, “Modeling Phase Transf0Rmation f0R Residual Stress Study in se1ective Laser Melting Processes by Finite Element/Matlab Integration,” 7th IIAE International Conference on Industrial Application Engineering, (ICIAE2019), Kitakyushu, Japan, March 26-30, 2019.
[A102] P-C Lin, Y-F Cheng, and K-S Chen (2018, Dec). Design and Realization of a Novel Elastomer Characterization System f0R Precision Positioning Application.18th Mechatronik 2018, Brno, Czech.
[A101] Y-C Li and K-S Chen (2018, Nov). Design, Realization, and Decoupling Control of a Single-Axis Cascaded Stage Based on Compliant Mechanisms and Rubber Bearings. ICPE2018: 17th International Conference on Precision Engineering,Kamakura, Japan.
[A100] M-C Tsai, L-K Chang, C-L Lu, and K-S Chen (2018, Oct). Impedance Control of Self-sensing Piezoelectric Actuat0R f0R Vibration Suppression. International Conference on Electric Machines and Systems (ICEMS 2018), Jeju, K0Rea
[A99]   Yishuan Yu, Kung Han Lee, Kuo-Shen Chen, Yun-Hui Liu (2018, Sep). Damping Enhancement and Positioning Control of Compliant Stages by Inc0Rp0Rating Rubber Shear Dampers. SICE 2018, SICE Annual Conference, Nara, Japan.
[A98]   Yu-Cheng Chen, Chi-An Chen, Kuo-Shen Chen, Yun-Hui Liu (2018, Sep). Mechanical Properties Characterizations of Elastomer Pads f0R Rubber-Bearing Stage Design and Control. SICE 2018, SICE Annual Conference, Nara, Japan.
[A97]   C-F Chuang and K-S Chen, “A New Technique f0R Creating Curved Interi0R Holes on Ultrathin Glass Based on Picosecond Laser Drilling and Thermo-Shock Separation,” DTIP 2018, Rome, Italy, may 2018.
[A96]   Chun-Hung Wu, Shu-Heng Guo, Kuo-Shen Chen, “Design and Realization of a Novel Perf0Rmance and Durability Test Platf0Rm f0R Anti-lock Braking Module,” 6th IIAE International Conference on Industrial Application Engineering, (ICIAE2018), Okinawa, Japan, March 27, 2018.
[A95]   Jui Min Tsai, Kuo-Shen Chen, Syuan-Wen Chen, Yun-Hui Liu, Da-Huei Lee, “Design of a Novel Sensing Module f0R Machine Tool Vibration Monit0Ring by Integrating Multiple MEMS Accelerometers,” 6th IIAE International Conference on Industrial Application Engineering, (ICIAE2018), Okinawa, Japan, March 27, 2017. (Best Student paper)
[A94]   Po-Hsuan Han, Ching-Wei Lee, Kuo-Shen Chen, “A Preliminary Study of Inverse Kinematics Analysis and Experimental Validation of a 3-DOF SCARA Robot Mechanism,” 6th IIAE International Conference on Industrial Application Engineering, (ICIAE2018), Okinawa, Japan, March 27, 2017.
[A93]   Tsung-Yen LEE, Chiao-Fen CHUANG, Shang-Qi LIN, Tz-Cheng CHIU, Kuo-Shen CHEN, Tian-Shian YANG,and Mao-Chi LIN, “Analysis of Stress in Ultrathin Glass Modified with Picosecond Laser,” 12th International Symposium on Advanced Science and Technology in Experimental Mechanics (12th ISEM'17-Kanazawa), Nov. 1-5, Kanazawa, Japan.
[A92]   Tian-Shiang YANG, Ting-Hsiang CHAI, Kuo-Shen CHEN, Kok Shen CHONG and Wei-Hsien LI, “Monit0Ring and Cleaning of Filtration-Film Clogging in Acid-Tank Circulation System f0R Semiconduct0R Manufacturing,” 12th International Symposium on Advanced Science and Technology in Experimental Mechanics (12th ISEM'17-Kanazawa), Nov. 1-5, Kanazawa, Japan.
[A91]   Kuo-Shen CHEN, Jo-Fen CHUANG, Tz-Cheng CHIU, Tian-Shiang YANG, and Mao-Chi LIN, “On the Separation of Chemically Strengthened Ultrathin Glass Based on Fast Laser Induced Subcritical Crack Growth,” 12th International Symposium on Advanced Science and Technology in Experimental Mechanics (12th ISEM'17-Kanazawa), Nov. 1-5, Kanazawa, Japan.
[A90]   C.-L. Hsiao, C.-Y. Yang, H.-C. Chen, T.-S. Yang, K.-S. Chen, T.-H. Wu, Y.-C. Wang, S. Lee, “Identification of Curing Kinetics of Epoxy Molding Compounds and Mold Flow Analysis f0R Assessment of Die-Shift Defects,” in Proc. 12th International Microsystems, Packaging, Assembly, Circuits Technology (IMPACT 2017), Taipei, Taiwan, Oct. 2017. (Best Paper)
[A89]   Y-C Sun and K-S Chen, “Development of Signal Transmission and Reduction Modules f0R Status Monit0Ring and Prediction of Machine Tools,” SICE Annular Conference, Kanazawa, Japan, Sep. 23 2017.
[A88]   Stanislav Vechet, Jiri Krejsa, Jan Hrbacek, and Kuo-Shen Chen, “Probabilistic Reasoning in Diagnostic Expert System f0R Smart Homes,” Mechatronics 2017, Brno, Czech Republic, Sep 5-8, 2017.
[A87]   H.-Y. Zhan, T.-H. Li, C.-H. Cheng, S.-H. Kuo, and K.-S. Chen, “Development of Dual Wiimote-Based 3D Localization Schemes f0R Mobile Robot and Quadcopter Integration,” Mechatronics 2017, Brno, Czech Republic, Sep 5-8, 2017.
[A86]   C.-Y. Yang, Y.-C. Liu, K.-S. Chen*, T.-S. Yang, Y-C Wang, and S-S Lee, “Process Emulation f0R Predicting Die Shift and Wafer Warpage in Wafer Reconstitution,” ICEPT 2017, Harbin, China, Aug16-19, 2017. 
[A85]   Hui-Yuan Chan*, Ting-Hao Li, and Kuo-Shen Chen, “Development of 3D Positioning Scheme by Integration of Multiple Wiimote IR Cameras,” 5th IIAE International Conference on Industrial Application Engineering, (ICIAE2017), Kitakyushu, Japan, March 27, 2017.
[A84]   Yu-Cheng Chen, Kuo-Shen Chen, Yun-Hui Liu, “Analysis and Design of a Novel 3-DOF Translational and Rotational Elastomeric Bearing Positioning Stage,” 5th IIAE International Conference on Industrial Application Engineering, (ICIAE2017), Kitakyushu, Japan, March 27, 2017. (Best Paper)
[A83]   Shu Heng Guo, Chung Hao Cheng, Kuo Shen Chen, Stanislav Vechet, “Developing Wiimote Indo0R Localization Environment f0R Mobile Robot and Quadcopter Interaction in Motion Planning Applications,” 5th IIAE International Conference on Industrial Application Engineering, (ICIAE2017), Kitakyushu, Japan, March 27, 2017.
[A82]   Cheng-Ying Yang, Yu-Cheng Liu, Kuo-Shen Chen, Tian-Shiang Yang, Yao-Chen Wang, “Thermo-mechanical and Mold Flow Analyses of Die Shift in Wafer Reconstitution Process f0R Advanced Packaging Technology,” 5th IIAE International Conference on Industrial Application Engineering, (ICIAE2017), Kitakyushu, Japan, March 27, 2017. (Best Presentation)
[A81]   W-J Chen, K-S Chen, and Y-H Liu, “Finite Element Simulation f0R Input Shaping Design of Long Range Motion Systems: Analyses and Applications, “6th INTERNATIONAL ENGINEERING SYMPOSIUM (IES 2017), Kumamoto University, Kumamoto, Japan. (Invited)
[A80]   K-S CHEN and T-S YANG, “Command Shaping Design f0R Motion-Induced Vibration Suppression: Recent Developments and Perspective,” 7th International Conference on Positioning Technology (ICPT 2016), Seoul, K0Rea, Nov. 2016. (Plenary Speaker)
[A79]   Y.C. Li, J. W. Lee, K. S. Chen and Y. H. Liu, “Design and control of a compliant stage with high disturbance rejection f0R precision inspection applications,” Proc. 7th International Conference on Positioning Technology, Seoul, South K0Rea, Nov, 2016.
[A78]   W-T Lin, K-S Chen, Y-C Chen, and S. Vechet, “Suppression of Motion-Induced Vibration f0R a Two-DoF System Using State Feedback Control,” 2016 IEEE International Power Electronics and Motion Control Conference (PEMC 16), Varna, Bulgaria, Sep. 2016.
[A77]   Y-K Chang,K-S Chen, C-C Chen, C-K Cheng, and S-H Guo, “Effect of Operating Temperature and Humidity on the Optical and material Perf0Rmance of LCD Modules,” International Conf. on Machining, Material, and Mechanical Technologies, Matsue, Japan, Oct. 2016.  
[A76]   C. F. Chuang, K. S. Chen, T. C. Chiu, T. Y. Lee, T. S. Yang, and M. C. Lin, "Effect of Laser Processing on the Mechanical Properties of Ultrathin Chemically Strengthened Glasses f0R P0Rtable Device Applications, "International Conference on Machining, Materials and Mechanical Technologies, Matsue, Japan, Oct. 2016.
[A75]   Y-C Teng, K-S Chen, and Y-C Chen, Design and Control of a One-Dimensional Stage Based on Elastomeric Bearing Technology, MESA 2016, The 12th IEEE/ASME International Conference on International Conference on Mechatronic and Embedded Applications, Auckland, New Zealand, Aug. 2016.
[A74]   Yen-Feng Cheng, Pei-Chung Lin, Kuo-Shen Chen, Ching-Huei Chu, “Design and Fabrication of a Novel Elastomers Material Testing System,” 4th IIAE International Conference on Industrial Application Engineering, (ICIAE2017), Beppu, Oita, Japan, March 25, 2016.
[A73]   Rong-Can Hong, Kuo-Shen Chen, “Improvement of Stiffness Models f0R Laminated Rubber Bearing using Hyperelastic Finite Element Analysis,” 4th IIAE International Conference on Industrial Application Engineering, (ICIAE2016), Beppu, Oita, Japan, March 25, 2016. (Best Paper)
[A72]   Yi-Hsuan Yu, Yen-Feng Cheng, Kuo-Shen Chen, Yun-Hui Liu, Wei-Chin Huang, “Design and Realization of a Polymer Compliant Stage with 3D Printing and Rubber Damping,” 4th IIAE International Conference on Industrial Application Engineering, (ICIAE2016), Beppu, Oita, Japan, March 25, 2016.
[A71]   Chung-Hao Cheng, Ming-Feng Wu, Chin-Tien Huang, Kuo-Shen Chen, “Load-cell Based Smart Flo0R Panel f0R Indo0R Localization Applications,” 4th IIAE International Conference on Industrial Application Engineering, (ICIAE2016), Beppu, Oita, Japan, March 25, 2016. (Best Presentation)
[A70]   K-S Chen et al, Thermo-Mechanical Analysis of Laser Peeling of Ultrathin Glass f0R Removing Edge Flaws in Web Processing Applications, DTIP 2016 (Budapest, May 28-June 02, 2016)
[A69]  T. H. Li and K-S Chen, A Wiimote 3D Localization Scheme without Channel Constraints, Mechatronics 2015, Warsaw, Poland, Sep. 2015. (6次)
[A68]   S. Vechet, J. Kresja, and K-S Chen, “Enhancement of Autonomous Robot Navigation via Sens0R Failure Detection,” Mechatronics 2015, Warsaw, Poland, Sep. 2015.
[A67]   R-C Hong, J-F Chuang, and Kuo-Shen Chen, “Thermo-mechanical analysis and characterization of laser glass processing”第七屆兩岸實驗力學研討會, Jul. 2015, 重慶大學, 重慶市.
[A66]   K-S Ou and K-S Chen, “Electromechanical Coupling Characteristics of MEMS Micro Cantilevers with Applications,” DTIP 2015, Montpellier France, April 2015.
[A65]   H. H. Huang and K-S Chen, DESIGN OF A NOVEL PVDF-BASED PIEZOELECTRIC ENERGY HARVESTER WITH BEATING MECHANISMS, 4th International Engineering Symposium - IES 2015, March 4-6, 2015, Kumamoto University, Japan.
[A64]   Y-C Teng and K-S Chen, “Design, Analysis, and Control of an Elastomeric Bearing Positioning Stage,”6th International Conference on Positioning Technology, Kitakyushu, Japan, Nov. 2014. (Best Paper)
[A63]   K-S Chen, DESIGN, ANALYSIS, AND EXPERIMENTAL STUDIES OF A NOVEL PVDF-BASED PIEZOELECTRIC ENERGY HARVESTER WITH BEATING MECHANISMS,ASME 2014, International Mechanical Engineering Congress and Exposition (IMECE 2014), Montreal Canada. (3次)
[A62]   C. Chung, R. Hong, K-S Chen, and C-C Chen, “The Investigation of Buckling, Def0Rmation and Interaction of Elastic Films f0R Touch Panel Applications,” in Proc. 9th International Microsystems, Packaging, Assembly, Circuits Technology (IMPACT 2014), Taipei, Taiwan, Oct. 2014.
[A61]   Y. G. Tsai, K-S Chen, and T-H Yang, “Stress analysis and characterization of PECVD oxide/nitride multi-layered films after thermal cycling,” ACMFMS2014, Nara, Japan, Oct. 2014.               
[A60]   林佩君, 陳國聲, 鄭晏鋒      雙軸式材料測試系統之設計與實現及其在橡膠軸承之應用, 第六屆兩岸實驗力學研討會, Sep. 2014, 台中中興大學.
[A59]   C. Chung, R. Hong, K-S Chen, and C-C Chen, “Buckling Analysis f0R a Rectangular Membrane f0R Touch Panel Applications,” in Proc. 15th International Conference on Electronic Packaging Technology (ICEPT 2014), Chengdu China, Aug. 2014. 
[A58]   Y. G. Tsai and K. S. Chen, “Modeling and Experimental Validations on Residual Stress Evolution of PECVD Films During Rapid Thermal Annealing, 16th International Conference on Experimental Mechanics (ICEM16), July 07-10, 2014, Cambridge, UK.
[A57]   Y. T. Fu and K. S. Chen, “A Novel Indo0R Localization Scheme by Integrating Wiimote Sensing and A Controllable IR-LED Array,” In Proc. Mechatronics 2013, pp. 567-574, Brno, Czech Republic, Oct, 2013. 
[A56]   VĚCHET, S.; CHEN, K.; KREJSA, J. Hybrid Navigation Method f0R Dynamic Indo0R Environment Based on Mixed Potential Fields. In Recent Technological and Scientific Advances. 2013. p. 575-582. 
[A55]   K-S Chen and S. L. Wu “Modeling of Chemical Mechanical Polishing Processes by Cellular Automata and Finite Element/Matlab Integration Methods” Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS - DTIP’13- Barcelona, Spain 16-18 April 2013
[A54]   J. W. Lee, K-S Chen, and Y. H. Liu, “Design, Analysis, and Control of a Cascaded Piezoelectric Actuated Two-Degrees-of-Freedom Precision Stage” 3rd International Engineering Symposium - IES 2013, March 4-6, 2013, Kumamoto University, Japan
[A53]   Chia-Hsing Pi, Ming-Fong Wu, and Kuo-Shen Chen, “Touch Sensing Design based on Strain and F0Rce Measurements”第五屆兩岸實驗力學研討會, Aug. 2012, 昆明.
[A52]   M. H. Chen, Y. T. Fu, K-S Ou, and K-S Chen, “On the Development of Autonomously Manipulation of Group Mobile Robots f0R Smart Living and Biomimetic Applications,” 2012 IEEE International Conference on Computer Science and Automation Engineering (CSAE 2012), Hunan, China, May 2012. (3次)
[A51]   D. Gu, Y. T. Fu, K-S Ou, and K-S Chen, “Design of Wiimote Indo0R Localization Technology f0R Omni-directional Vehicle Traject0Ry Control” 2012 IEEE International Conference on Computer Science and Automation Engineering (CSAE 2012), Hunan, China, May 2012. 
[A50]   D. Gu, Y-D Fu, K-S Ou, and K-S Chen, "Wiimote-based indo0R localization f0R smart living space applications,"6th Japan-Taiwan W0Rkshop on Mechanical and Aerospace Engineering, Sapp0Ro, Japan, Dec. 7-10, 2011
[A49]    A. Barton-Martinelli, D. Cuff, K-S Chen, and D. L. Trumper, "Design and Realization of a Novel Elastomer Mechanical Properties Characterization System" ASPE 2011 Annual Meeting, Nov. 2011, Denver, CO, USA (Accepted).
[A48]    D. Gu, P.-W. Chen, K.-S. Ou, Y.-D. Fu, and K.-S. Chen “Design and Perf0Rmance Evaluation of Wiimote-Based Two-Dimensional Indo0R Localization Systems,” Automation 2011, The 11th International Conference on Automation Technology, Yunlin, Taiwan, Nov. 2011
[A47]    Y. H. Liu, C. M. Chao, C. T. Lu, and K-S Chen, "Vibration control on single axis flexible piezoelectric positioning stage by PID controller", the 5th International Symposium on Environmental Vibrations (ISEV 2011), Oct 20-22, Chengdu, China, 2011.
[A46]    M.-H. Chen, D. Gu, Y.-D. Fu, C.-H.Pi, K.-S.Ou, and K.-S. Chen, "Wireless Group Manipulation of Autonomously Guided Mobile Robots f0R Smart Living Space Applications",Proc. SICE 2011, 50th Annual Conf. of the Society of Instrument and Control Engineers of Japan, pp. 2143-2148, Sep. 2011, Tokyo, Japan. (4次)
[A45]    C-H Pi, K-S Ou, M-H Chen, and K-S Chen, "Analysis, Simulation, and Experimental Investigations of a One Dimensional Touch Panel Based on Strain Sensing" Proc. SICE 2011, 50th Annual Conf. of the Society of Instrument and Control Engineers of Japan, pp. 1954-1959, Sep. 2011, Tokyo, Japan. (2次)
[A44]   Z-K Huang, K-S Ou, and K-S Chen, “Nanoindentation Characterization of PECVD Silicon Nitride on Silicon Subjected to Mechanical Fatigue Loading,” MRS Fall Meeting, Boston, MA, USA, Nov. 29-Dec. 03, 2010. 
[A43]   P-W Chen, K-S Ou, and K-S Chen, “IR indo0R localization and wireless transmission f0R motion control in smart building applications based on Wiimote technology,” Proc. SICE 2010, 49th Annual Conf. of the Society of Instrument and Control Engineers of Japan, pp. 1781-5, 2010 
[A42]   I-K Lin, P-H Wu, K-S Ou, K-S Chen, X. Zhang, "The Tunability in Mechanical Properties and Fracture Toughness of Sputtered Silicon Oxynitride Thin Films f0R MEMS-based Infrared Detect0Rs" MRS Fall Meeting, Boston, MA, USA, Nov. 30-Dec. 04, 2009. (2次)
[A41]   K-S Ou, I-K Lin, P-H Wu, Zhi-Kai Huang, K-S Chen, X. Zhang, "Mechanical Characterization of Atomic Layer Deposited (ALD) Alumina f0R Applications in C0Rrosive Environments," MRS Fall Meeting, Boston, MA, USA, Nov. 30-Dec. 04, 2009. (3 次)
[A40]   I-K Lin, K-S Ou, K-S Chen, X. Zhang, "Cellular F0Rce Measurement in Cardiac Myocytes Using Polymer Micropillar Array with Viscoelastic Characterization," Micro TAS 2009, Jeju, K0Rea, Nov. 2009. 
[A39]   K-S Ou, K-S Chen, T-S Yang, and S-Y Lee, "A Novel Semi-Analytical Approach f0R Micro Beams Subjected to Electrostatic Loads and Residual Stress Gradients," ASME IDETC 2009, Aug 30-Sep. 3, 2009 San Diego, CA, USA. (3次)
[A38]   歐廣順, 林奕寬, 陳國聲, "PDMS 黏彈性質檢測與其在細胞力學上之應用," 第三屆海峽兩岸實驗力學研討會, 呼和浩特, 內蒙古July 2009.
[A37]   K-S Chen and K-S Ou, "Fast Positioning and Impact Minimizing of MEMS Devices by Suppression Motion-Induced Vibration by Command Shaping Method," MEMS 2009 Jan 25-29, S0Rrento, Italy.
[A36]   Yang, T.-S., Wang, Y.-C., Chen, K.-S., Chen, Y.-C. & Yen, J.-L. (November 2008) Optimization of wafer-back pressure profile in chemical mechanical planarization. Presented at the 2008 Annual Meeting of the Division of Fluid Dynamics, American Physical Society, November 23-25, 2008, San Antonio, Texas, USA. (5次)
[A35]   I-K Lin, Y-M Liao, Y. Liu, K-S Ou, K-S Chen, and X. Zhang, "Elastic and Viscoelastic Characterization and Modeling of Polymer based Structures f0R Biological Applications," ASME IMECE 2008, Nov. 2008 Boston, MA, USA. (Best Paper award)
[A34]   I-L Lin, Y-M Liao, K-S Chen, and X. Zhang, "Viscoelastic Characterization of Soft Micropillars f0R Cellular Mechanics Study," MicroTAS 2008, San Diego, Oct. 2008. 
[A33]   I-K Lin, Y-M Liao, Y. Liu, K-S Ou, K-S Chen, and X. Zhang, "Elastic and Viscoelastic Characterization of Polydimethylsiloxane (PDMS) f0R Biological Applications," Hilton Head Conference 2008, June 01-05, 2008.
[A32]   H-M Yeh and Kuo-Shen Chen, "Development of Device-Level Chemical-Mechanical Polishing Simulation Module," 4th APCOT, June23-25, 2008, Tainan, Taiwan.
[A31]   Y-M Liao, I-K Lin, K-S Ou, K-S Chen, and Xin Zhang, "Elastic and Viscoelastic Characterization of Polydimethylsiloxane (PDMS) f0R Biological Applications," 4th APCOT, June 23-25, 2008, Tainan, Taiwan.
[A30]   H-Y Yan, K-S Ou, and K-S Chen, “Indentation Characterization of Fracture Toughness and Interfacial Strength of PECVD Nitrides after Rapid Thermal Annealing” Materials Research Society Fall Meeting, Boston, MA, Nov. 2007.
[A29]   I-K Lin, Y-M Liao, K-S Chen, and X. Zhang, “Elastic and Viscoelastic Characterization of Polydimethylsiloxane (PDMS) f0R Cell-Mechanics Applications” Materials Research Society Fall Meeting, Boston, MA, Nov. 2007. 
[A28]   K.-S. Ou, H.-Y. Yan, K.-S. Chen,"Mechanical Characterization of KMPR by Nanoindentation f0R MEMS Applications," ICEM13, Greece, July 2007.
[A27]   H.-Y. Yan, K.-S. Ou, K.-S. Chen,"Mechanical Properties Measurement of PECVD silicon Nitride After Rapid Thermal Annealing Using Nanoindentation Technique", ICEM13, Greece, July 2007.
[A26]   K.S. Chen, T.Y. Chen, H.Y. Yan, I.T. Huang, J.K. Chen, "Mechanical Properties Characteristics of Rubber O-Rings by Digital Image C0Rrelation and Nanoindentation," 2007 SEM Annual Conference & Exposition, Springfield, MA, USA. June3-6, 2007.
[A25]   Hsiu-Ming Yeh, Kuo-Shen Chen, and I-Kuan Lin, "Development of Electron Beam Lithography 3D Fabrication Emulat0R: A Current Status Rep0Rt", Proc. Symposium on Nano Device Technology (SNDT) April 28, 2006 Hsinchu, Taiwan
[A24]   K.-S. Ou, K.-S. Chen, and J. Shieh, "Characterization of Dynamic Characteristics of RF MEMS Switches: Current Progress and Future Perspective" Proc. Symposium on Nano Device Technology (SNDT) April 28, 2006 Hsinchu, Taiwan
[A23]   K-S Chen, Residual Vibration Suppression f0R Duffing Nonlinear Systems with Electromagnetically Actuation Using Nonlinear Input Shaping Techniques, Presented in the 1st Cross-Strait Experimental Mechanics W0Rkshop, Aug.01-3, 2005 Beijing, China.
[A22]   Y-Y Wang and K-S Chen, "Probablistic Fatigue Test f0R MEMS Materials: Conceptural Design and Current Progress"Proc. Symposium on Nano Device Technology (SNDT) May 04, 2005. Hsinchu, Taiwan.
[A21]   I-K Lin, K-S Chen, and F-H Ko, “Modeling f0R SU-8 Struuctures Fabricated by Electron Beam Lithography,” Proc. Symposium on Nano Device Technology (SNDT), May 11, 2004, pp. 301-304.
[A20]   K-S Chen, T. Y. Chen, J-C Chuang, and I-K Lin, “Full- Field Wafer Level Thin Film Stress Measurement By Phase-Stepping Shadow M0Rie,” ICEM12- 12th International Conference on Experimental Mechanics, 29 August - 2 September, 2004 Politecnico di Bari, Italy
[A19]   J-K Chen, I-K Lin, F-H Ko, F-C Chang, and K-S Chen, “Plasma Resistance and Behavi0R of Polybenzoxazine Polymer,” 2003 International Microprocess and Nanotechnology Conference, Oct. 2003, Japan.
[A18]   K-S Chen, K-S Ou, C-H Cheng, R-F Hsu, Y-M Yeh, and T. Y. Chen, "An Improved Wafer Curvature to Film Stress Conversion f0R Residual Stress Measurements", International Symposium on Experimental Mechanics, Taipei, Taiwan, Dec. 2002. (NSC90-2212-E-006-054)
[A17]   X. Zhang, K-S Chen, S. M. Spearing, “Residual Stress and Fracture of Thick Dielectric Films f0R Power MEMS Applications,” 15th IEEE International Micro Electro Mechanical Systems Conference (MEMS02), Jan 2002 . (NSC89-2212-E-006-093) 
[A16]   K-S Chen, “On the Unification of Material Strength Testing f0R MEMS Applications,” Material Research Society Meeting, Nov. 2001, Boston, MA. . (NSC90-2212-E-006-055) (1)
[A15]   K-S Chen, X. Zhang, S. M. Spearing, “Processing of Thick Dielectric Films f0R Power MEMS: Stress and Fracture,” Material Research Society Meeting, Nov. 2000, Boston, MA. (NSC89-2212-E-006-093) 
[A14]   X. Zhang, R. Ghodssi, K-S Chen, A. A. Ayon, and S. M. Spearing, “Residual Stress Characterization of Thick PECVD TEOS Film f0R Power MEMS Application,” Proceeding of 2000 Solid-State Sens0R and Actuat0R W0Rkshop, June 4, 2000, Hilton Head, SC, pp. 316-319. (NSC89-2212-E-006-093) 
[A13]   N. Hagood IV, D. Roberts, L. Saggere, K. Breuer, K-S Chen, J. Carretero, H. Li, R. Mlcak, S. Pulitzer, M. Schmidt, S. Spearing, and Y. H. Su, “Micro Hydraulic Transducer Technology f0R Actuation and Power Generation,” Proceedings of SPIE V3985, pp. 680-688, 2000. 
[A12]   N. Hagood IV, D. Roberts, M. Schmidt, S. Spearing, K. Breuer, R. Mlcak, J. Carretero, F. Ganji, H. Li, K-S Chen, Y. Su, and S. Pulitzer "Development of Micro Hydraulic Transducer Technology", ICAST '99 (International Conference on Adaptive Structures and Technologies) Paris, France, October 11-13,1999. 
[A11]   R. Ghodssi, X. Zhang, K-S Chen, K. A. Lohner, S. M. Spearing, and M. A. Schmidt, “Residual Stress Characterization of Thick PECVD Oxide Films f0R MEMS Applications,” American Vacuum Society 46th International Symposium, Seattle, WA, USA, Oct. 1999.
[A10]   Kuo-Shen Chen, S. Mark Spearing, Noel N. Nemeth, “Structural Design of a Silicon Micro Turbo Generat0R,”AIAA-99-1332, Proceedings of the 1999 40th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, April, 1999, pp. 1144-1153.
[A9]     Kuo-Shen Chen, Arturo A. Ayon, Kevin A. Lohner, Mark A. Kepets, Terran K. Melconian, S. Mark Spearing, “Dependence of Silicon Fracture Strength and Surface M0Rphology on Deep Reactive Ion Etching Parameters,” MRS Fall Meeting, Mat. Res. Soc. Symp. Proc. 546, 21-26, 1999. 
[A8]     A. A. Ayón, K.-S Chen, K. A. Lohner, S. M. Spearing, H. H. Sawin and M. A. Schmidt, “Deep Reactive Ion Etching of Silicon,” Mat. Res. Soc. Symp. Proc. 546, 1999. 
[A7]     Kevin A. Lohner, Kuo-Shen Chen, Arturo A. Ayon, S. Mark Spearing, “Microfabricated Silicon Carbide Microengine Structures,” Mat. Res. Soc. Symp. Proc. 546, 85-90, 1999*
[A6]     K-S Chen, A. A. Ayon, S. M. Spearing, "Silicon Strength Testing f0R Mesoscale Structural Applications," MRS Spring Meeting, MRS Symposium Proceeding Vol. 518, pp. 123-130, 1998.
[A5]     Epstein, A. H., S.D. Senturia, G. Anathasuresh, A. Ayon, K. Breuer, K-S Chen, F. E. Ehrich, G. Gauba, R. Ghodssi, C. Grosherny, S. Jacobson, J.H. Lang, C-C Lin, A Merha, J.M. Miranda, S. Nagle, D.J. 0Rr, E. Piekos, M.A. Schmidt, G. Shirley, M.S. Spearing, C.S. Tan, Y-S Tzeng, I.A. Waitz: "Power MEMS and Microengines," IEEE Transducers '97 Conference, Chicago, IL, June 1997. 
[A4]     Epstein, A. H, S.D. Senturia, O. Al-Midani, G. Anathasuresh, A. Ayon, K. Breuer, K-S Chen, F.F. Ehrich, E. Esteve, L. Frechette, G. Gauba, R. Ghodssi, C. Groshenry, S.A. Jacobson, J.L. Kerrebrock, J.H. Lang, C-C Lin, A. London, J. Lopata, A. Mehra, J.O. Mur Miranda, S. Nagle, D.J. 0Rr, E. Piekos, M.A. Schmidt, G. Shirley, S.M. Spearing, C.S. Tan, Y-S Tzeng, I.A. Waitz, Micro-Heat Engines, Gas Turbines, and Rocket Engines - the MIT Microengine Project,” 28th AIAA Fluid Dynamics and 4th AIAA Shear Flow Control  Conference, June 1997. 
[A3]     K-S Chen, A. Montero, D. L. Trumper, S. Smith, and M.E. Williams, " Spring Dominated Regime Design of a High Load Capacity, Electromagnetically Driven X-Y-qStage," Proceeding of 10th ASPE Annual Conference, Austin, Texas, Oct. 1995.
[A2]     M. K. H0R, J. Y. M. Chen, and K-S Chen, “Wavelet Transf0Rm in Depth Recovery,” Proceedings of SPIE International Symposium on Intelligent Robotic Systems, Boston, Mass., September 1993. 
[A1]          M. K. H0R, K-S Chen, and J. Y. M. Chen, “On the Integration of An Experimental Hand-Eye Robot System,” The First Chinese W0Rld Congress on Intelligent Control and Intelligent Automation, Beijin, China, August 1993.
計畫與產學合作
2016-21
1. Computation and analysis of thermofluid fields and their effects on product perf0Rmance f0R MLCC heat processe, 共同主持人, 國巨公司計畫, 2021/7/1-2023/6/30 金額 250萬. 
2. MOCVD 製程之熱流場與力學分析及工程失效原因與對策研究, 主持人 漢民公司計畫 70萬 (2021-7/1 -2022/6/30)
3. Giga Fab PM 推車, 定位&叫車 App 系統開發, 主持人, 台積電公司計畫 100萬 (2021/3/1-2022/2/28).
4. 工具機資訊整合與整廠智能化研究: 狀態監控模組, 故障診斷方法, 以及資訊整合於整廠任務規劃 (109-2221-E-006-096) 主持人, 科技部計畫, 2020/8/1-2021/7/31     118.2萬
5. 前瞻技術產學合作計畫-前瞻技術產學合作計畫-新世代車用動力驅動關鍵模組整合設計之智能化平台建置(3/3), 共同主持人, 科技部計畫前瞻技術產學合作計畫-(109-2622-8-006-005) 7600萬.
6. 運用共振水波槽之海浪獵能器開發:觀念設計、系統動態分析與原型建置(109-2221-E-006-111)共同主持人, 科技部計畫, 2020/8/1-2021/7/31    99.1萬
7. 基於位移與速度回授之整合主動隔振與擾動抑制控制系統設計與實現研究(III) (109-2221-E-218-007) 共同主持人, 科技部計畫, 2020/8/1-2021/7/31   76.7萬
8. 晶圓重組製程之非對稱翹曲分析與防治 主持人, 日月光公司計畫, 2020/7/1-2021/6/30       60萬
9. 整合Bosch mMS4.0 與無人自動搬運車導航技術於現代化工業4.0智慧工廠之發展 (109-2927-I-006-508) 台捷交流計畫  (2年) 主持人, 科技部計畫, 2020/1/1-2021/12/31    44.4萬
10. 智慧切削感測模組之實現, 加工訊號領域知識建立, 以及結合人工智慧於工具機刀具狀態診斷 (108-2221-E-006-209) 主持人, 科技部計畫, 2019/8/1-2020/7/31   117萬
11. 前瞻技術產學合作計畫-前瞻技術產學合作計畫-新世代車用動力驅動關鍵模組整合設計之智能化平台建置(2/3) (108-2622-8-006-014) 共同主持人, 科技部計畫, 2019/8/1-2020/7/31      7500萬
12. 前瞻技術產學合作計畫-前瞻技術產學合作計畫-新世代車用動力驅動關鍵模組整合設計之智能化平台建置 (107-2622-8-006-015) 共同主持人, 科技部計畫, 2018/8/1-2019/7/31       6950萬
13. 工具機用之加速規之設計,整合,與實現           (107-2221-E-218-014-) 共同主持人, 科技部計畫, 2018/8/1-2019/7/31       74.7萬
14. 多孔性吸附濾清器之熱質傳計算及其工業應用實驗  (107-2221-E-006-236) 共同主持人, 科技部計畫, 2018/8/1-2019/7/31       92.0萬
15. 金屬粉末雷射熔融積層製程參數模擬最佳化分析(3/3)(107-2218-E-006-007-) 共同主持人, 科技部計畫, 2018/5/1-2019/4/30        375.5萬
16. 晶片打線機振動量測系統建立, 監控, 以及振動改善與打線效率提升開發計畫 主持人, 日月光公司計畫, 2018/1/1-2018/12/31       60萬
17. 工具機監控與壽命分析之CPS技術開發-以DED複合機台為例(3/3)(107-2218-E-006-004-) 共同主持人, 科技部計畫, 2018/3/1-2019/2/28     1100萬
18. 工具機用之加速規之設計,整合,與實現 (106-2221-E-218-014) 共同主持人, 科技部計畫, 2017/8/1-2018/10/31       71.2萬
19. 工具機監控與壽命分析之CPS技術開發-以DED複合機台為例(2/3)(106-2218-E-006-004-) 共同主持人, 科技部計畫, 2017/3/1-2018/2/28      1060萬
20. 金屬粉末雷射熔融積層製程參數模擬最佳化分析(2/3)(106-2218-E-006-007-) 共同主持人, 科技部計畫, 2017/5/1-2018/4/30       375.5萬
21. 散出型晶圓級構裝製程缺陷分析與對策 共同主持人, 日月光公司計畫, 2017/1/1-2017/12/31   60萬
22. 針對晶圓重組製程之翹曲度預測結構與參數最佳化設計 共同主持人, 日月光公司計畫, 2017/1/1-2017/12/31   60萬
23. 機車防鎖死剎車(ABS) 性能評估與耐久測試之載台設計實現與測試標準建立 (2年) 主持人, 慶齡基金會計畫, 2016/10/1-2018/9/30      141萬
24. 半導體後段製程薄膜結構機械性質檢測與結構性能表現之分析設計 (3年) (105-2221-E-006-074-MY3) 主持人, 科技部計畫, 2016/8/1-2019/7/31     363萬
25. 橡膠軸承結構精密定位平台設計,控制, 與其在精密檢測之應用研究(3年) (105-2221-E-006-100-MY3) 主持人, 科技部計畫, 2016/8/1-2019/7/31        337萬
26. 工具機監控與壽命分析之CPS技術開發-以DED複合機台為例(1/3)(105-2218-E-006-015-) 共同主持人, 科技部計畫, 2016/3/1-2017/2/28        1000萬
27. 金屬粉末雷射熔融積層製程參數模擬最佳化分析(1/3)(105-2218-E-006-018-) 共同主持人, 科技部計畫, 2016/5/1-2017/4/30        364.5萬
28. 基於位移與速度回授之整合主動隔振與擾動抑制控制系統設計與實現研究(105-2221-E-218-016-) 共同主持人, 科技部計畫, 2016/8/1-2017/7/31    71.9萬29. 強化玻璃裂痕分析       共同主持人, 工研院計畫, 2016/3/1-2017/12/31       80萬
30. A Mechanical Study on Filtration film Clogging in an Acid-tank Circulation system 共同主持人, 台積電計畫, 2015/10/1-2017/5/31       180萬
31. 先進製程封裝之晶圓級模流分析 共同主持人, 日月光公司計畫, 2015/10/1-2016/11/30  60萬
32. Reliability Characterization, Analysis, and Methodology Establishment f0R Display and Electronics Packaging Applications 主持人, 美商 CISCO計畫, 2015/8/1-2017/1/31       52500美金(174萬)
33. 基於3D 列印與加速度回授之撓性平台設計與控制與其在精密檢測之應用(104-2221-E-218-010-) 共同主持人, 科技部計畫, 2015/8/1-2016/7/31    65.4萬
34. 整合振動抑制與獵能之基礎與應用研究(I)(104-2221-E-006-121-) 主持人, 科技部計畫, 2015/8/1-2016/7/31           116.3萬
35. 積層製造高效能散熱結構與阻尼材料之設計與流固體力學分析 主持人, 工研院計畫, 2015/3/1-2015/12/31           80萬
36. 多孔性吸附反應器之熱質傳分析與實驗研究(103-2221-E-006-096-MY3) 共同主持人, 科技部計畫, 2014/8/1-2017/7/31        306.7萬
 
 
專利及技術移轉
1. A 智慧型建築體 中華民國 I398569 , 2013/07-2029/11
2. A 多波段加速規,中華民國 I716139,  (2021/0-2039/10).
其他
1989年清華大學動力機械系全系第一名畢業.
2005 國科會吳大猷紀念獎 (2005年度, 機械固力學門推薦代表)
2007 第一屆國立成功大學工學院明日之星計畫得獎人 (2007年)
2007 指導大專生參與國科會計畫獲獎 (學生陳慕全) (2007年)
2008 中國工程師學會石延平論文獎 (2008年)
2007-2010國科會傑出學者養成計劃
2011-2014國科會優秀年輕學者計劃
2008 最佳論文, Micro/Nano Technology F0Rum, ASME IMECE 2008 (Nov. 2008, Boston, MA)
2009年東元科技Green Tech 創意競賽亞軍 (Aug. 29, 2009)
2009 韓國首爾國際發明展, 題目: 「趴趴走的綠色 空間精靈」, 獲選金牌獎, 大會特別獎 ( 俄國科學與技術合作協會特別獎, 塞爾維亞特別獎) (Dec. 07, 2009)
2011 指導學生參與中國工程師學會學生論文競賽機械組第一名 (June 2011, 學生畢家興)
2011 指導大專生參與國科會計畫獲獎 (學生畢家興) 
2011 意法半導體校園 iNEMO 創意競賽亞軍 ( 學生傅育德, 李庭豪, 李哲維)
2012 意法半導體校園 iNEMO 創意競賽佳作 (學生徐佳生, 李庭豪, 鄭中豪)
2012 執行國科會計畫 “模組化無線感測與致動器設計及其智慧化居住空間之應用 (NSC-97-2221-E006-152-MY3)成果優異, 國科會主動招開成果發表記者會
2012中國工程師學會石延平論文獎 (2012)
2014 指導學生中國工程師學會學生論文競賽機械組第二名 (June 2014, 學生洪榮燦)
2014 指導學生鄧諺舉於6th International Conf. on Positioning Technology (ICPT 2014) (Nov. 2014 日本小倉) 獲選 Young Research Award.
2014 指導學生林佩君榮獲第十一屆上銀科技獎金牌獎.(103年 12月 28日)
2015 指導大專生參與國科會計畫獲獎 (學生陳昱丞) 
2015 接受工具機與零組件雜誌編輯專訪, 以“盡機械人本分, 勇於接受挑戰為題,說明個人在產學研究之經驗分享
2015 執行工研院計畫, 整體成果代表台灣參與美國 R&D 100 2015 評選
2015 指導學生獲力學競賽論文佳作 (Nov. 2015, 學生洪榮燦)
2015 第一屆旭泰科技論文獎銅獎 (Nov. 2015, 學生鄧諺舉)
2016  Best paper award, ICIAE (日本大分縣別府市) (Mar. 2016, 學生洪榮燦)
2016 獲邀代表台灣擔任 ICPT 2016 (Nov. Seoul, South K0Rea) 之 keynote speaker. 
2017 Best paper award, ICIAE (日本北九州小倉) (Mar. 2017, 學生 楊承穎)
2017 指導學生中國工程師學會學生論文競賽機械組佳作 (May 2017, 學生孫翊淳)
2017 中國工程師學會高雄分會工程教授獎.
2017 指導大專生參與國科會計畫獲獎 (學生詹惠媛)
2018 Best student paper award, ICIAE (日本沖繩) (Mar. 2018, 學生 蔡瑞敏)
2018 赴德國 Bosch/Rexroth 受訓, 獲頒工業4.0教員證
2018 指導學生榮獲康寧論文獎 (學生洪榮燦)
2018 指導學生榮獲康寶論文銀獎(學生韓伯炫), 特別獎(孫翊淳)
2018  U. Malaya 國際博士論文審查委員 (2018)
2019 指導學生蔡瑞敏榮獲15屆上銀科技工具機特別獎.(108年 1月 5日)
2019 Best student paper award, ICIAE (日本北九州小倉) (Mar. 2019, 學生 陳世春)
2019指導學生中國工程師學會學生論文競賽機械組佳作 (May 2019, 學生徐星琪)
2019 國立成功大學輔導傑出教授
2019 國立成功大學教學傑出教授
2019 中國工程師學會傑出工程教授獎
2019 指導大專生參與科技部計畫獲獎 (學生徐星琪)
2019 獲邀擔任科學人雜誌科創講堂講座智慧製造主題主講人 (2019)
2020 指導學生孫翊淳榮獲16屆上銀科技銅質獎.(109年 1月 5日)
2020 Best student paper award, ICIAE (日本島根松江) (Mar. 2020, 學生 李恭漢)
2020 指導學生中國工程師學會學生論文競賽機械組優等 (Aug. 2020, 學生楊閎喻)
 2020   中國機械工程師學會工程教授獎
2021  Best student paper award, ICIAE (日本小倉) (Mar. 2021, 學生 鄭人齊)





服務:
Technical Committee: 第八,九,十,十一,十三, 二十屆奈米工程與微系統技術研討會 (2004 - 2007, 2009, 2016)
台灣大學, 清華大學, 交通大學, 成功大學, 中興大學, 中山大學等校邀請演講
台灣大學,清華大學, 中正大學, 中興大學, 虎尾科技大學, 明新科技大學, 台北科技大學, 淡江大學, 文化大學教師升等外審委員
國家晶片設計中心 (CIC) 晶片設計審查委員 (2008~)
2003 行政院精密儀器發展中心微機電系統技術與應用專書編審委員會委員 (2003)
2005 國科會第六屆大專院校創意競賽國際賽執行秘書(Dec. 2005, 高雄科工館)
2007 Technical Committee: 2007 International Conference on Advanced Manufacture (ICAM 2007, Nov. 26-30 NCKU) 
2007 Technical Committee: ISFM2007 (International F0Rum on System and Mechatronics, Dec. 3-6, 2007 NCKU)
2007 經濟部2015精密機械技術發展規劃評論委員 (Sep. 2007)
2007 第二屆海峽兩岸實驗力學研討會總幹事 (Oct. 2007, 台南, 成功大學)
2008 Session Chair, 4th Asia-Pacific Conf. of Transducers and Micro-Nano Technology (APCOT 2008), June 2008, Tainan.
2009 科技部自動化學門產學複審委員 (2009)
2009 第26屆中國機械工程學會研討會幹事 (11/21/2009, 台南, 成功大學)
2010年中國工程師學會論文獎評審委員 (March 2010)
2010 16屆世界微機械高峰會中華民國代表 (D0Rtmund, Germany, April 2010)
2010 國科會自動化學門 Bio-Inspired 重點研究規劃委員 (2010)
2011 Session Chair, 5th International Symposium on Environmental Vibration (ISEV 2011), Chengdu, China. Oct. 2011. 
2012 科技大學評鑑委員, 負責評鑑高苑科技大學及遠東科技大學.
2013 Session Chair, Mechatronics 2013 conference (Brno, Czech Republic, Oct 7-9) Robotics Session. 
2012 Guest Edit0R:  International Journal of Automation and Smart Technology (Vol. 3, No. 4)
2014 Symposium 0Rganizer: ISMEN 2014, MEMS/NEMS Symposium (Sep. 2014, NCKU)
2014科技部工程司自動化學門 『前瞻科技及產業自動化』規劃委員 (2014)
2014 經濟部技術處A+企業創新專案審查委員 (Dec. 2014)
2015 Session 0Rganizer/co-chair, ASME IMECE 2014, Vibration and control f0R smart structures (Nov. Montreal, Canada)
2015 Keynote speaker, 3rd international engineering symposium (IES2015), Kumamoto University, Kumamoto  Japan (Mar. 2015)
2015 Session Chair, Mechatronics 2015 conference (Warsaw, Poland, Sep22-24) Robotics Session. 
2015/16 Program Committee Member, DTIP 2015 (Design, Testing, Integration, and Packaging of MEMS and MOEM conference), Montpellier France, Apr. 27-30, 
2015 國立中山大學電機系工程認證委員
2016 Program Committee Member, DTIP 2016 (Design, Testing, Integration, and Packaging of MEMS and MOEM conference), Budapest, May 30-June 02, 2016
2016, 第六屆台/日/韓精密定位會議 (ICPT 2016), 大會邀請演講(代表台灣), 以及在閉幕式代表台灣上台報告會議籌備 (Nov. 2016, 韓國首爾)
2017, 工研院產學合作計畫審查委員 (量測中心).
2017, Keynote speaker, 5rd international engineering symposium (IES2017), Kumamoto University, Kumamoto  Japan (Mar. 2017)
2017 Program Committee Member, DTIP 2017 (Design, Testing, Integration, and Packaging of MEMS and MOEM conference), Boudreaux, France,  May 29-June 01, 2017.
2017, Scientific committee, Mechatronics 2017 (Sep. 06-8, Brno, Czech Republic). 
2018, 通過德國 Bosch/Rexroth I4.0 Train f0R Trainer 並獲證書
2018, Technical committee, DTIP2018 (May 22-25, Roma, Italy)
2019, 科技部產學司複審委員
2019, Technical committee, DTIP2019 (May 12-15, Paris, France)
2019, Scientific Committee, Mechatronics 2019 (Sep 16-18, Warsaw, Poland)
2020, 科技部自動化學門申覆委員
 2021, 科技部自動化學門複審委員
 2021, Associate edit0R, Frontier of Mechnaical Engineering, MEMS section.