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BS. Power Mechanical Engineering, National Tsing-Hua University (1989)
MS. Mechanical Engineering, Massachusetts Institute of Technology, USA (1995)
Ph.D. Mechanical Engineering, Massachusetts Institute of Technology, USA (1999)
Post Doctoral researcher, Aeronautics and Astronautics Department, Massachusetts Institute of Technology, USA (1999)
2nd Lieutenant, Amry armor division (1990-92)
Research assistant, institute of informaton science, Academia Sinica (1992-93)

Assistant Professor, NCKU ME (1999-2003)
Associate Professor, NCKU ME (2003-2007)
Professor, NCKU ME (2007 -) 
Visiting professor, MIT (2010-11)
Dupty head, ME, NCKU (2017-2020)

Micro / Nano mechnaics and simulation
Material characterization
Precision design and motion control
Vibration engineering
Intelligent manufacturing
Mobile robots and vehicles

Electronic packaging
Status monitoring and diagnosis
Mobile robots and indoor localization
Precsion motion control and vibration suppression
Testing system designs (material characterization, ABS)
semiconductor feabriaction equipment design 

Engineering mechanics
Mechanical Vibrations
Measurement and Instrumentations
Electric circuits
Advanced mechanics of Materials
Analytical Dynamics
System Dynamics and Modeling
Semiconductor processing
Advanced semiconductor processing equipment
Advanced vibration mechanics
Introduction to Microelectromechanical Systems

1. Refereed Journal Paper

 
[1]         S. M. Spearing and K-S Chen, 1997/08, "Micro Gas Turbine Engine Materials and Structures,"    Ceramic Engineering and Science Proceedings, Vol. 18(4), pp. 11-18. 
[2]         N. Hagood IV, D. Roberts, M. Schmidt, S. Spearing, K. Breuer, R. Mlcak, J. Carretero, F. Ganji, H. Li, K-S Chen, Y. Su, and S. Pulitzer "Microhydraulic transducer technology for actuation and power generation", Proceedings of SPIE - The International Society for Optical Engineering, v 3985, p 680-688, 2000.
[3]        Kuo-Shen Chen*, A. A. Ayon, S. M. Spearing, 2000/06, "Controlling and Testing the Fracture Strength of Silicon on the Mesoscale," J. American Ceramic Society, Vol. 83, no. 6, pp. 1476-1484.
[4]        Kuo-Shen Chen*, S. Mark Spearing, Noel N. Nemeth, 2001/04, “Structural Design of a Silicon Micro Turbo Generator”, AIAA Journal, Vol. 39, No. 4, pp. 720-728.
[5]        X. Zhang, K-S Chen, R. Ghodssi, A. A. Ayon, and S. M. Spearing, 2001/07, “Residual Stress and Fracture in Thick Tetraethylorthosilicate (TEOS) and Silane-Based PECVD Oxide Films, Sensors and Actuators (A), Vol. 91. pp. 379-386.
[6]        Y. N. Su,K-S Chen, D. C. Roberts, S. M. Spearing, 2001/11, “Large Deflection Analysis of Thin Annular Plates,” J. Micromechanics and Microengineering, Vol. 11, pp. 645-654.
[7]        K-S Chen*, A. A. Ayon, X. Zhang, S. M. Spearing, 2002/06, "Effect of Process Parameters on the Surface Morphology and Mechanical Performance of Silicon After Deep Reactive Ion Etching (DRIE)”, ASME/IEEE J. Microelectromechanical Systems, V. 11, pp. 264-275.
[8]        K-S Chen*, D. L. Trumper, S. T. Smith, 2002/10, “Design and Control of an Electromagnetically Driven X-Y-qStage,” Precision Engineering- Journal of the International Societies for Precision Engineering and Nanotechnology, Vol. 26, pp.355-369, 2002.
[9]        K-S Chen*, S-Y Lin, and J-Y Chen, 2002/07, “Fracture Analysis of Thick PECVD Oxide Films for Improving Structural Integrity of Power MEMS,"J. Micromechanics and Microengineering,V. 12, pp. 714-722.
[10]      K-S Chen* and K-S Ou, 2002/11, "Modification of Curvature-Based Thin Film Residual Stresses Measurement for MEMS Applications",J. Micromechanics & Microengineering, V.12, pp. 917-924.
[11]      K-S Chen*, J-J Zheng, and H-M Yeh, 2002/12 “Development of MEMS Fabrication Emulator By Solid Modeling Technology,” J. Chinese Society of Mechanical Engineering,, V. 23, pp. 525-532.
[12]      X. Zhang, K-S Chen, S. M. Spearing, 2003/01, "Thermal Mechanical Behavior of Thick PECVD Oxide Films for Power MEMS Applications," Sensors and Actuators (A), Vol. 103, pp. 263-270.
[13]       K-S Chen*, X. Zhang, and S-Y Lin, 2003/07, “Intrinsic Stress Generation and Relaxation of Plasma Enhanced Chemical Vapor Deposited Oxide During Deposition and Subsequent Thermal Cycling,”Thin Solid Films, V434, pp.190-202.
[14]       K-S Chen* and C-C Ho, 2004/01 “Electromagnets Calibration Utilizing the Pull-In Instability,” Precision Engineering- Journal of the International Societies for Precision Engineering and Nanotechnology ,Vol. 28,1, 106-115.
[15]      K-S Chen*, J-F Yin, T-S Yang, and K-S Ou, 2004/02 “Vibration Suppression of a Cantilever Beam by Input Shaping,” J. Chinese Society of Mechanical Engineering, Vol. 25, pp. 59-67 (EI) (NSC90-2212-E-006-059, NSC92-2212-E-006-122)
[16]      K-S Chen*, L-M Li, and K-S Ou, 2004/02 “Accuracy Assessment of Simplified Electromechanical Coupling Solvers for MEMS Applications” J. Micromechanics & Microengineering, V. 14, pp. 159-169.
[17]      T-S Yang, N-T Hsu, K-S Chen, and F-H Ko, 2004/04 “Analysis of Experimental Data for Metallic Impurity Out-Diffusion FR0M Deep Ultraviolet Phot0Resist,” J. Electrochemistry Society, Vol. 151, No. 2, pp. G149-G154. 
[18]      K-S Chen*and K-S Ou, 2004/04 "Equivalent Strengths for Reliability Assessment of MEMS structures," Sensors & Actuators A, Vol. 112, pp. 163-174, 2004.
[19]      J-K Chen, I-K Lin, F-H Ko, C-F Huang, K-S Chen and F-C Chang, 2004/09 “Behavior and Surface Energies of Polybenzoxazines formed by Polymerization with Argon, Oxygen, and Hydrogen Plasmas,” Journal of Polymer Science B: Polymer Physics,vol. 42, pp. 4063-4074, 2004.
[20]      K-S Chen*, T. Y. Chen, J-C Chuang, and I-K Lin, 2004/09 "Full- Field Wafer Level Thin Film Stress Measurement By Phase-Stepping Shadow Morie,"IEEE Transaction of Component and Packaging Technology, Vol. 27, 3, pp. 594-601, 2004.
[21]      K-S Chen*, J-F Yin, T-S Yang, K-S Ou, 2004/09 "Residual Vibration Suppression of a Cantilever Beam Using Command Shaping Technology," Trans. Aeronautical and Astronautical Soc. ROC, Vol. 36, 3, pp. 249-257, 2004.
[22]       K-S Chen*, I-K Lin, and F-H Ko, 2005/10 “Fabrication of 3D Polymer Microstructures Using Electron Beam Lithography and Nanoimprinting Technologies,” J. Micromechanics and Microengineering, Vol. 15, pp. 1894-1903, 2005.
[23]     T-S Yang, K-S Chen, C-C Lee, and J-F Yin, 2006/01 “Suppression of Motion-Induced Residual Vibration of a Cantilever Beam by Input Shaping,” J. Engineering Mathematics, V.54, pp.1-15, 2006.
[24]     Kuo-Shen Chen*, B0R-Zone Chen, and Chin-Chuang Huang, 2006/12 "Design and Control of a Piezoelectrical Driven Fatigue Testing System f0R Electronic Packaging Applications", IEEE Trans. Components and Packaging Technologies, Vol. 29, pp. 841-849, 2006.
[25]      K-S Chen*, T-S Yang, and J-F Yin, 2006/12 “Residual Vibration Suppression for Duffing Nonlinear Systems with Electromagnetically Actuation Using Nonlinear Command Shaping Techniques,” ASME J. Vibrations and Acoustics, Vol. 127, pp. 778-789, 2006.
[26]      K-S Chen* and R-F Hsu, 2007/03 "Evaluation of Environmental Effects on Mechanical Properties and Characterization of Creep Behavi0R of PMMA,"J. Chinese Institute of Engineering, Vol. 30, pp. 267-274, 2007.
[27]      T.-S. Yang, K.-S. Chen, C.-C. Lee and I. Hu, 2007/04 "Suppression of motion-induced residual longitudinal vibration of an elastic rod by input shaping," J. Eng. Mathematics, Vol. 57, pp. 365-379, 2007.
[28]      K-S Chen* and K-S Ou, 2007/05 "Development and Verification of 2D Dynamic Electromechanical Coupling Solver for Micro-Electrostatic-Actuator Applications," Sensors & Actuators A Physical, Vol. 136, pp. 403-411.
[29]      K-S Chen* and K-S Ou, 2007/06 "Command Shaping Techniques for Electrostatic MEMS Actuation: Analysis and Simulation," IEEE J. Microelectromechanical Systems,Vol. 16, pp. 537-549, 2007.
[30]      H-M Yeh, K-S Chen*, and I-K Lin, 2007/06 "Development of 3D Electron Beam Lithography Fabrication Simulator," Tamkang Journal of Science and Engineering, Vol. 10, pp. 167-172, 2007.
[31]      K-S Ou, H-Y Yan, and K-S Chen*, 2007/05 “Mechanical Characterization of KMPR by Nanoindentation for MEMS Applications,"Strain, Vol.44, pp. 267-271, 2008.
[32]       K-S Chen* and H-M Yeh, "Development of Geometrical Based Fabrication Emulator for MEMS Micromachining and Excimer Laser Ablation," J. Chinese Institute of Engineers, Vol. 31, pp. 41-51, 2008.
[33]      H-Y Yan, K-S Ou, and K-S Chen*, "Mechanical Properties Measurement of PECVD Silicon Nitride after Rapid Thermal Annealing Using Nanoindentation Technique," Strain, Vol.44, pp. 259-266, 2008.
[34]       K-S Chen*, T-C Chen, and K-S Ou, "Development of Semi-Empirical F0Rmulation to Extracting Materials Proper Through Indentation Tests: Residual Stresses, Substrate Effect, and Creep," Thin Solid Films Vol. 516, pp. 1931-1940, 2008.
[35]       K-S Chen*, T-S Yang, K-S Ou, and J-F Yin, "Design of Command Shapers for Residual Vibration Suppression in Duffing Nonlinear Systems," Mechatronics, Vol. 19, pp. 184-198, 2009.
[36]       K-S Ou, K-S Chen*, T-S Yang, and S-Y Lee "A Command Shaping Approach to Enhance the Dynamic Performance and Longevity of Contact Switches," Mechatronics,Vol. 19, pp. 375-389, 2009.
[37]       I-K Lin, Y-M Liao, Y. Lu, K-S Ou, K-S Chen, and X. Zhang, "Mechanical Behavior of Soft Microcantilever-based Force Sensors," Applied Physics Letter, Vol. 93, 251907, 2008.
[38]       T-S Yang, Y-C Wang, K-S Chen, Y-C Chen, and J-L Yan, "Optimization of Wafer-back Pressure Profile in Chemical Mechanical Planarization," J. Electrical Chemical Society, Vol. 155, H720-729, 2008.
[39]       K-S Chen*, H-M Yeh, J-L Yan, and Y-C Chen, "Finite-element analysis on wafer-level CMP contact stress: reinvestigated issues and the effects of se1ected process parameters," International J. Advanced Manufacturing Technology, Vol. 42, pp.1118-1130, 2009.
[40]       H-M Yeh and K-S Chen*, "Development of a Digital-Convolution-Based Process Emulator for Three-Dimensional Microstructure Fabrication Using Electron-Beam Lithography,"IEEE J. Industrial Electronics, Vol. 56, No. 4, pp. 926-936, April 2009.
[41]       I-K Lin, Y-M Liao, Y. Lu, K-S Ou, K-S Chen, and X. Zhang,"Elastic and Viscoelastic Characterization and Modeling of Polymer based Structures for Biological Applications," IEEE/ASME J. Microelectromechanical Systems, Vol. 18,pp. 1087-1099, 2009.
[42]       Tian-Shiang Yang, Ian Hu, Kuo-Shen Chen, Chia-Liang Liu, and Yao-Chen Wang, "Effects of Retaining Ring on Contact Stress Uniformity in Chemical Mechanical Planarization,"Journal of the Chinese Society of Mechanical Engineers, Vol.30, No.5, pp.381~392 (2009).
[43]       K-S Chen*, K-S Ou, and Y-M Liao, "On the Influence of Roller Misalignments on the Web Behavior during Roll-to-Roll Processing" J. Chinese Institute of Engineers, Vol. 34, pp. 87-97, 2011
[44]       K-S Chen* and K-S Ou, “Suppression of Motion-Induced Vibration for Electromagnetically Actuated Flexible Structures Using Nonlinear Command Shaping Technique,” Journal of Vibration and Control, Vol. 16, pp. 1713-1734, 2010.
[45]       H-M Yeh and K-S Chen*, "Development of a Pad Conditioning Simulation Module with a Diamond Dresser f0R CMP Applications," International J. Advanced Manufacturing Technology,Vol. 50, pp.1-12, 2010.
[46]       K-S Ou, K-S Chen*, T-S Yang, and S-Y Lee, “Fast Positioning and Impact Minimizing of MEMS Devices by Suppression Motion-Induced Vibration by Command Shaping Method,” IEEE/ASME J. Microelctromechanical Systems, Vol. 20, pp. 128-129, 2011.
[47]       I-K Lin, P-H Wu, K-S Ou, K-S Chen*, and X. Zhang, "Mechanical property characterization of sputtered and plasma enhanced chemical deposition (PECVD) silicon nitride films after rapid thermal annealing" Sensors and Actuators A: Physical, Vol. 117, pp. 117-126, 2011.
[48]       K-S Ou, K-S Chen*, T-S Yang, and S-Y Lee, “A Novel Semi-Analytical Approach for Micro Beams Subjected to Electrostatic Loads and Residual Stress Gradients,” IEEE/ASME J. Microelectromechanical Systems, Vol. 20, pp. 527-537, 2011.
[49]       C-X Dai and K-S Chen*, "Residual Vibration Suppression of Crane Movement by Input Shaping: Experimental Investigation and Finite Element Dynamics Simulations" Journal of Chinese Society of Mechanical Engineers, Vol. 34, pp. 497-506, 2013.
[50]       I. Hu, T-S Yang, and K-S Chen, “Synergetic effects of wafer rigidity and retaining-ring parameters on contact stress uniformity in chemical mechanical planarization,” Int. J. Adv. Manuf. Technol, Vol. 56, pp.523-538, 2011.
[51]       W-C Lin, C-X Dai, D-L Deng, K-S Ou, and K-S Chen” Performance Evaluation of Drift-Free Integration for Navigation and Velocity Feedback Applications,” J. Chinese Institute of Engineers, Vol. 35, pp. 767-778, 2012.
[52]       M-H Chen, Y-D Fu, K-S Ou, and K-S Chen*, "Development of Navigation Schemes for Mobile Robot Group Leading Biomimetic Applications", International Journal of Automation and Smart Technology, Vol. 2, no. 1, pp. 29-41, 2012.
[53]       C-H Pi, I-F Tsai, K-S Ou, and K-S Chen*, "A One-Dimensional Touch Panel Based on Strain Sensing," Mechatronics, Vol. 22, pp. 802-810, Apr. 2012.
[54]       B-W Chen, D. Gu, K-S Ou, M-H Chen, and K-S Chen*,"IR Indo0R Localization and Motion Control in Smart Living Space Applications Based on Wiimote Technology: A Preliminary Demonstration,"J. Chinese Society of Mechanical Engineers,Vol. 35, pp. 187-196, 2014.
[55]       J. W. Lee, K-S Chen, and Y. H. Liu, “Design, Analysis, and Control of a Cascaded Piezoelectric Actuated Two-Degrees-of-Freedom Precision Stage”International J. of Earth Science, Vol. 6, pp. 856-861, 2013.
[56]       K-S Ou and K-S Chen*, “Pull-in Voltage Estimation of Micro Cantilever Beams with Effects of Residual Stress Gradients and Capacitance Fringing,” IEEE/ASME Trans. Device and Materials Reliability, Vol. 14, pp. 577-579, March 2014.
[57]       S. Věchet, K-S Chen, J. Krejsa, “Navigation Method for Autonomous Robots in a Dynamic Indoor Environment”, International Journal of Automation and Smart Technology, Vol. 3, no. 4, pp. 273-277, Dec, 2013.
[58]       Z. K. Huang and K-S Chen*, “Nanoindentation Fracture and Fatigue Characterization of PECVD Silicon Nitride Films Subjected to Rapid Thermal Annealing,” Sens0Rs and Actuators, A, Physical, Vol. 207, pp. 49-60, 2014.
[59]       W. C. Wang, J. W. Lee, K-S Chen*, and W-H Liu, “Design and vibration control of a notch-based compliant stage for display panel inspection applications,”Journal of Sound and Vibration, Vol. 333, pp. 2701-2718, May, 2014.
[60]       C-H Pi and K-S Chen*, “A Strain-Sensing Based Scheme for Indoor Localization: Analysis, Alg0Rithm, and Demonstration,” Measurement, Vol. 52, pp. 224-235, May 2014.
[61]       S. L. Wu and K-S Chen*,“Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods,” Microsystem Technologies, Vol. 21, pp. 1879-1892, Sep. 2015.
[62]       D. Gu and K-S Chen*, “Design and Performance Evaluation of Wiimote-Based Two-Dimensional Indoor Localization Systems for Intelligent Living Applications”Measurement, Vol. 66, pp. 95-108, 2015.
[63]       K-S Chen* and R-C Hong, On the Stiffness of Elastomer Bearings for Precision Machine Design,” JOURNAL OF THE CHINESE SOCIETY OF MECHANICAL ENGINEERS 37.6 (2016): 533-546.
[64]       H. H. Huang and K-S Chen*, “DESIGN, ANALYSIS, AND EXPERIMENTAL STUDIES OF A NOVEL PVDF-BASED PIEZOELECTRIC ENERGY HARVESTER WITH BEATING MECHANISMS,”Sens0Rs and Actuat0Rs A, Physical, Vol. 238, pp. 317-328, 2016. (2次)
[65]       K-S Ou and K-S Chen*, “Developing Electromechanical Coupling Macro Models for Improving Dynamic Responses of MEMS Elastic Structures with Command Shaping Techniques,” IEEE Trans. Device and Materials Reliability, Vol. 16, pp. 123-131, 2016.
[66]       J. W. Lee, K-S Chen*, and Y-C Li “Design and Control of a Cascaded Piezoelectric Actuated Two-Degrees-of-Freedom Positioning Stage for LCD Array Repair Applications,”Precision Engineering, Vol. 45, pp. 374-386, 2016.
[67]       T. C. Chiu, C-A Hua, C-H Wang, K-S Chen, T-S Yang, C-D Wen, C-H Li, M-C Lin, C-J Huang, and K-T Chen, “On the Mechanics of Laser Peeling for Ultra-Thin Glasses,” Engineering Fracture Mechanics, Vol. 163, pp. 236-247, 2016.
[68]       Y-C Deng and K-S Chen*, “Analysis, Design, and Control of a Novel Elastomeric Bearing Positioning Stage,” MDPI Inventions, Vol.1, pp. 17-28, 2016.
[69]       C-H Chuang, K-S Chen*, Y-K Chang, and C-C Chen, “Buckling and Postbuckling Failure Analyses on a Rectangular Membrane for Touch Panel Applications,” IEEE Trans. Device and Materials Reliability, Vol. 17, pp. 204-212, March, 2017.
[70]       K-S Chen*, T-S Yang, R-C Hong, T-C Chiu, and M-C Lin, “Thermo-Mechanical Analysis of Laser Peeling of Ultrathin Glass for Removing Edge Flaws in Web Processing Applications,” Microsystem Technologies, Vol. 24, pp. 397-409, 2018.
[71]       C-H Cheng, M-F Wu, S-H Guo, K-S Chen*, “Realization and Performance Assessment of a Force-Sensing Based Smart Floor Panel for Indoor Localization Applications,” Sensors and Actuators, A: Physical, Vol. 285, p. 468-481, 2019.
[72]       Y-T Fu and K-S Chen*,” An Indoor Localization Scheme by Integrating Wiimote and a IR-LED Array for Mobile Robot Navigations,” Journal of Chinese Society of Mechanical Engineers, Vol. 40, pp. 21-31, 2019.
[73]       C.-F. Chuang, K.-S. Chen*, T.-C. Chiu, T.-S. Yang, M.-C. Lin, ”Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations,” Sensors and Actuators, A: Physical, Vol. 301, 111723, 2020.
[74]       Y-K Chang, K-S Chen*, and C-C Chen, “Characterization and Image-Based Performance Evaluation on the Longevity of LCDs Under High Temperature and Humid Environment,” IEEE Trans. Device and Materials Reliability, Vol. 20, pp. 42-50, 2020.
[75]       H-C Hsu, H-Y Chan, T-H Li, and K-S Chen*, “Development of General Wiimote 3D Localization Scheme and its Application on Robot Arm Attitude Detection,” Journal of the Institute of Industrial Applications Engineers, Vol. 8, pp. 8-15, 2020.
[76]       C-Y Yang, K-S Chen*, and T-S Yang, “Reconstituted Wafer Deformation Analysis through Whole Process Emulation,” IEEE Trans. Device and Materials Reliability, Vol. 20, pp. 172-180, 2020.
[77]       W-J Chen and K-S Chen*, “Finite Element Based Input Shaping Design for Suppressing Motion-Induced Vibrations” Journal of Chinese Society of Mechanical Engineers, vol. 42, n1, pp 1-10. (2021)
[78]       K-S Chen*, Y-G Tsai, and T-H Yang, “Stress Analysis and Characterization of PECVD Oxide/Nitride Multi-Layered Films after Thermal Cycling,” IEEE Trans. Device and Materials Reliability (Accepted, Dec. 02, 2020)
[79]       T-H Li, K-S Chen*, S. Vechet, “Development and Demonstration of Indoor Three-Dimensional Localization Using IR CMOS Sens0Rs f0R Mobile Manipulators,” Sensors and Actuators A: Physical, Vol. 318, 112497, 2021.
[80]       J. M. Tsai, I. C. Sun, and K. S. Chen*, “Realization and Performance Evaluation of a Machine Tool Vibration Monitoring Module by Multiple MEMS Accelerometer Integrations,” International J. Advanced Manufacturing Technology, Vol. 114, pp.465–479, 2021.

國際研討會論文

[A122] W-C Wu, K-S Chen etal, "Development of Artificial Neural Network and Topology Reconstruction Schemes for Fan-Out Wafer Warpage Analysis," IEEE 71st Electronic Components and Technology Conference (ECTC 2021), Jun, 2021, San Diego, USA. 
[A121] K-S Chen et al, "Development of Semi-Analytical Formulation for Asymmetric Warpage Prediction in Fan-out Reconstitution Process," 2021 International Conference on Electronics Packaging (ICEP 2021), May 12-14, Tokyo Japan. 

[A120] H-M Lin, J-J Wang, K-S Chen, "Prediction and Simulation for Turning Chatter Control by Spindle Speed Variation, " 9th IIAE International Conference on Industrial Application Engineering, (ICIAE2021), Kitakyushu, Japan, March 27, 2021.
[A119] T-H Hsueh, S-H Guo, S-H Hung, K-S Chen, M-C Tsai, "Performance Benchmark Characterization and Braking Maneuverability Evaluation of Antilock Braking System with a Self-Developed Tester"  9th IIAE International Conference on Industrial Application Engineering, (ICIAE2021), Kitakyushu, Japan, March 27, 2021.
[A118] R-C Cheng, K-S Chen, Y-H Liu, L-K Chang, M-C Tsai,"Development of Autoencoder-Based Status Diagnosis Method for Ball Bearing Tribology Status Monitoring" 9th IIAE International Conference on Industrial Application Engineering, (ICIAE2021), Kitakyushu, Japan, March 27, 2021.
[A117] Chen, C. W., Chang, L. K., Liao, Y. T., Chung C. H., Su, W. C., Chen, K. S., Tsai, M. C., "Tuning of Servo Drive Controller Based on Boosted Tree Model and Particle Swarm Optimization,"23rd International Conference on Electrical Machines and Systems, ICEMS 2020. (
[A116] Stanislav Vechet, Jiri Krejsa, Kuo-Shen Chen: “AGVs Mission Control Support in Smart Factories by Decision Netw0Rks,” 19th Mechatronik 2020, Prague, Cezch Republic, Dec. 02-4, 2020.
[A115] Vojtěch Venglář, Jan Králík, Hong-Liang Chin, Kuo-Shen Chen: “Mesh Wi-Fi Infrastructure for Multi-agent Robotic System,” 19th Mechatronik 2020, Prague, Cezch Republic, Dec. 02-4, 2020.

[A114] D. R. Shen, H. L. Chin, C. H. Tu, J. S. Shih, V. Venglar, K. S. Chen, J. Krejsa, and S. Vechet, “Navigation and Task Planning of a Mobile Robot under ROS Environment: A Case Study Using Autorace Challenge”, 19^th Mechatronik 2020, Prague, Cezch Republic, Dec. 02-4, 2020.  
[A113] C-A Chen, Y-C Chen, K-S Chen, and Y-H Liu, “Design, Analysis, and Control of a Stiffness-Tunable 3-DOF Rubber-Bearing Positioning Stage”8th IIAE International Conference on Industrial Application Engineering, (ICIAE2020), Matsue, Japan, March 26, 2020.
[A112] K-H Lee, K-S Chen, and Y-H Liu, “Design and Control of a Compliant Stage with Reconfigurable Dynamic Characteristics by Incorporated Rubber Shear Damper,” 8th IIAE International Conference on Industrial Application Engineering, (ICIAE2020), Matsue, Japan, March 26, 2020.
[A111] Y-H Huang, Y-H Liu, and K-S Chen, “Design of Digital Communication Process for Condition Monitor Machine Tool”, 8th IIAE International Conference on Industrial Application Engineering, (ICIAE2020), Matsue, Japan, March 27, 2020.
[A110] J-H Wu, S-H Guo, K-S Chen, and M-C Tsai, “Design and Realization of a Performance and Reliability Evaluation Module for Commercialized Anti-lock Braking Systems”, pp. 237-245, Proc. 13^th Mechatronics 2019, Poland, Sep 16-18, 2019, Warsaw, Poland.
[A109] C-Y Yang, K-S Chen, T-S Yang, T-C Chiu, and C-J Ho, “Thermo-Mechanical Process Emulation and Sensitivity Analysis of Wafer Warpage after Reconstitution in Fan-out Packaging”, p03, Proc. International Conf. on Electronics Packaging (ICEP 2019), Niigata, Japan, April 17-20, 2019.
[A108] W-J Chen, K-S Chen, and M-C Tsai, “Finite Element Input Shaping Design for Vibration Suppression of Mechatronics Systems”, Proc. International Conf. on Mechatronics, Ilmenau, Germany Mar. 18-20, 2019.
[A107] S-H Guo, C-H Wu, and K-S Chen, “Design and Realization a Versatile Performance Test Platform for Motorcycle Anti-lock Braking System,” 7th IIAE International Conference on Industrial Application Engineering, (ICIAE2019), Kitakyushu, Japan, March 26-30, 2019.
[A106] I-C Sun, J-M Tsai, K-S Chen, Y-H Liu, T-S Yang, a nd M-C Tsai, “Design and Realization of a Sensing Module for Machine Tools Status Monit0Ring by Multiple MEMS Accelerometers Integration”,7th IIAE International Conference on Industrial Application Engineering, (ICIAE2019), Kitakyushu, Japan, March 26-30, 2019.
[A105] C-W Lee, Y-C Pei, K-S Chen, and S-Y Lee, “Application of Homography Transformation for Assisting Machine Vision in Automatic Guided Vehicles,” 7th IIAE International Conference on Industrial Application Engineering, (ICIAE2019), Kitakyushu, Japan, March 26-30, 2019.
[A104] S-C Hsu, T-H Li, H-Y Chan, and K-S Chen, ”General Dual Wiimote 3D Localization Scheme: Sensitivity Analysis and Its Application on Robot Arm Attitude Detection,” 7th IIAE International Conference on Industrial Application Engineering, (ICIAE2019), Kitakyushu, Japan, March 26-30, 2019.
[A103] S-C Chen, K-S Chen, and T-C Chiu, “Modeling Phase Transformation for Residual Stress Study in se1ective Laser Melting Processes by Finite Element/Matlab Integration,” 7th IIAE International Conference on Industrial Application Engineering, (ICIAE2019), Kitakyushu, Japan, March 26-30, 2019.
[A102] P-C Lin, Y-F Cheng, and K-S Chen (2018, Dec). Design and Realization of a Novel Elastomer Characterization System for Precision Positioning Application.18th Mechatronik 2018, Brno, Czech.
[A101] Y-C Li and K-S Chen (2018, Nov). Design, Realization, and Decoupling Control of a Single-Axis Cascaded Stage Based on Compliant Mechanisms and Rubber Bearings. ICPE2018: 17th International Conference on Precision Engineering,Kamakura, Japan.
[A100] M-C Tsai, L-K Chang, C-L Lu, and K-S Chen (2018, Oct). Impedance Control of Self-sensing Piezoelectric Actuator for Vibration Suppression. International Conference on Electric Machines and Systems (ICEMS 2018), Jeju, Korea
[A99]   Yishuan Yu, Kung Han Lee, Kuo-Shen Chen, Yun-Hui Liu (2018, Sep). Damping Enhancement and Positioning Control of Compliant Stages by Incorporating Rubber Shear Dampers. SICE 2018, SICE Annual Conference, Nara, Japan.
[A98]   Yu-Cheng Chen, Chi-An Chen, Kuo-Shen Chen, Yun-Hui Liu (2018, Sep). Mechanical Properties Characterizations of Elastomer Pads for Rubber-Bearing Stage Design and Control. SICE 2018, SICE Annual Conference, Nara, Japan.
[A97]   C-F Chuang and K-S Chen, “A New Technique for Creating Curved Interior Holes on Ultrathin Glass Based on Picosecond Laser Drilling and Thermo-Shock Separation,” DTIP 2018, Rome, Italy, may 2018.
[A96]   Chun-Hung Wu, Shu-Heng Guo, Kuo-Shen Chen, “Design and Realization of a Novel Perf0Rmance and Durability Test Platform for Anti-lock Braking Module,” 6th IIAE International Conference on Industrial Application Engineering, (ICIAE2018), Okinawa, Japan, March 27, 2018.
[A95]   Jui Min Tsai, Kuo-Shen Chen, Syuan-Wen Chen, Yun-Hui Liu, Da-Huei Lee, “Design of a Novel Sensing Module for Machine Tool Vibration Monit0Ring by Integrating Multiple MEMS Accelerometers,” 6th IIAE International Conference on Industrial Application Engineering, (ICIAE2018), Okinawa, Japan, March 27, 2017. (Best Student paper)
[A94]   Po-Hsuan Han, Ching-Wei Lee, Kuo-Shen Chen, “A Preliminary Study of Inverse Kinematics Analysis and Experimental Validation of a 3-DOF SCARA Robot Mechanism,” 6th IIAE International Conference on Industrial Application Engineering, (ICIAE2018), Okinawa, Japan, March 27, 2017.
[A93]   Tsung-Yen LEE, Chiao-Fen CHUANG, Shang-Qi LIN, Tz-Cheng CHIU, Kuo-Shen CHEN, Tian-Shian YANG,and Mao-Chi LIN, “Analysis of Stress in Ultrathin Glass Modified with Picosecond Laser,” 12th International Symposium on Advanced Science and Technology in Experimental Mechanics (12th ISEM'17-Kanazawa), Nov. 1-5, Kanazawa, Japan.
[A92]   Tian-Shiang YANG, Ting-Hsiang CHAI, Kuo-Shen CHEN, Kok Shen CHONG and Wei-Hsien LI, “Monitoring and Cleaning of Filtration-Film Clogging in Acid-Tank Circulation System for Semiconductor Manufacturing,” 12th International Symposium on Advanced Science and Technology in Experimental Mechanics (12th ISEM'17-Kanazawa), Nov. 1-5, Kanazawa, Japan.
[A91]   Kuo-Shen CHEN, Jo-Fen CHUANG, Tz-Cheng CHIU, Tian-Shiang YANG, and Mao-Chi LIN, “On the Separation of Chemically Strengthened Ultrathin Glass Based on Fast Laser Induced Subcritical Crack Growth,” 12th International Symposium on Advanced Science and Technology in Experimental Mechanics (12th ISEM'17-Kanazawa), Nov. 1-5, Kanazawa, Japan.
[A90]   C.-L. Hsiao, C.-Y. Yang, H.-C. Chen, T.-S. Yang, K.-S. Chen, T.-H. Wu, Y.-C. Wang, S. Lee, “Identification of Curing Kinetics of Epoxy Molding Compounds and Mold Flow Analysis for Assessment of Die-Shift Defects,” in Proc. 12th International Microsystems, Packaging, Assembly, Circuits Technology (IMPACT 2017), Taipei, Taiwan, Oct. 2017. (Best Paper)
[A89]   Y-C Sun and K-S Chen, “Development of Signal Transmission and Reduction Modules for Status Monit0Ring and Prediction of Machine Tools,” SICE Annular Conference, Kanazawa, Japan, Sep. 23 2017.
[A88]   Stanislav Vechet, Jiri Krejsa, Jan Hrbacek, and Kuo-Shen Chen, “Probabilistic Reasoning in Diagnostic Expert System for Smart Homes,” Mechatronics 2017, Brno, Czech Republic, Sep 5-8, 2017.
[A87]   H.-Y. Zhan, T.-H. Li, C.-H. Cheng, S.-H. Kuo, and K.-S. Chen, “Development of Dual Wiimote-Based 3D Localization Schemes for Mobile Robot and Quadcopter Integration,” Mechatronics 2017, Brno, Czech Republic, Sep 5-8, 2017.
[A86]   C.-Y. Yang, Y.-C. Liu, K.-S. Chen*, T.-S. Yang, Y-C Wang, and S-S Lee, “Process Emulation for Predicting Die Shift and Wafer Warpage in Wafer Reconstitution,” ICEPT 2017, Harbin, China, Aug16-19, 2017. 
[A85]   Hui-Yuan Chan*, Ting-Hao Li, and Kuo-Shen Chen, “Development of 3D Positioning Scheme by Integration of Multiple Wiimote IR Cameras,” 5^th IIAE International Conference on Industrial Application Engineering, (ICIAE2017), Kitakyushu, Japan, March 27, 2017.
[A84]   Yu-Cheng Chen, Kuo-Shen Chen, Yun-Hui Liu, “Analysis and Design of a Novel 3-DOF Translational and Rotational Elastomeric Bearing Positioning Stage,” 5th IIAE International Conference on Industrial Application Engineering, (ICIAE2017), Kitakyushu, Japan, March 27, 2017. (Best Paper)
[A83]   Shu Heng Guo, Chung Hao Cheng, Kuo Shen Chen, Stanislav Vechet, “Developing Wiimote Indoor Localization Environment for Mobile Robot and Quadcopter Interaction in Motion Planning Applications,” 5th IIAE International Conference on Industrial Application Engineering, (ICIAE2017), Kitakyushu, Japan, March 27, 2017.
[A82]   Cheng-Ying Yang, Yu-Cheng Liu, Kuo-Shen Chen, Tian-Shiang Yang, Yao-Chen Wang, “Thermo-mechanical and Mold Flow Analyses of Die Shift in Wafer Reconstitution Process f0R Advanced Packaging Technology,” 5th IIAE International Conference on Industrial Application Engineering, (ICIAE2017), Kitakyushu, Japan, March 27, 2017. (Best Presentation)
[A81]   W-J Chen, K-S Chen, and Y-H Liu, “Finite Element Simulation for Input Shaping Design of Long Range Motion Systems: Analyses and Applications, “6th INTERNATIONAL ENGINEERING SYMPOSIUM (IES 2017), Kumamoto University, Kumamoto, Japan. (Invited)
[A80]   K-S CHEN and T-S YANG, “Command Shaping Design for Motion-Induced Vibration Suppression: Recent Developments and Perspective,” 7th International Conference on Positioning Technology (ICPT 2016), Seoul, K0Rea, Nov. 2016. (Plenary Speaker)
[A79]   Y.C. Li, J. W. Lee, K. S. Chen and Y. H. Liu, “Design and control of a compliant stage with high disturbance rejection for precision inspection applications,” Proc. 7th International Conference on Positioning Technology, Seoul, South Korea, Nov, 2016.
[A78]   W-T Lin, K-S Chen, Y-C Chen, and S. Vechet, “Suppression of Motion-Induced Vibration for a Two-DoF System Using State Feedback Control,” 2016 IEEE International Power Electronics and Motion Control Conference (PEMC 16), Varna, Bulgaria, Sep. 2016.
[A77]   Y-K Chang,K-S Chen, C-C Chen, C-K Cheng, and S-H Guo, “Effect of Operating Temperature and Humidity on the Optical and material Performance of LCD Modules,” International Conf. on Machining, Material, and Mechanical Technologies, Matsue, Japan, Oct. 2016.  
[A76]   C. F. Chuang, K. S. Chen, T. C. Chiu, T. Y. Lee, T. S. Yang, and M. C. Lin, "Effect of Laser Processing on the Mechanical Properties of Ultrathin Chemically Strengthened Glasses f0R Portable Device Applications, "International Conference on Machining, Materials and Mechanical Technologies, Matsue, Japan, Oct. 2016.
[A75]   Y-C Teng, K-S Chen, and Y-C Chen, Design and Control of a One-Dimensional Stage Based on Elastomeric Bearing Technology, MESA 2016, The 12th IEEE/ASME International Conference on International Conference on Mechatronic and Embedded Applications, Auckland, New Zealand, Aug. 2016.
[A74]   Yen-Feng Cheng, Pei-Chung Lin, Kuo-Shen Chen, Ching-Huei Chu, “Design and Fabrication of a Novel Elastomers Material Testing System,” 4th IIAE International Conference on Industrial Application Engineering, (ICIAE2017), Beppu, Oita, Japan, March 25, 2016.
[A73]   Rong-Can Hong, Kuo-Shen Chen, “Improvement of Stiffness Models for Laminated Rubber Bearing using Hyperelastic Finite Element Analysis,” 4th IIAE International Conference on Industrial Application Engineering, (ICIAE2016), Beppu, Oita, Japan, March 25, 2016. (Best Paper)
[A72]   Yi-Hsuan Yu, Yen-Feng Cheng, Kuo-Shen Chen, Yun-Hui Liu, Wei-Chin Huang, “Design and Realization of a Polymer Compliant Stage with 3D Printing and Rubber Damping,” 4th IIAE International Conference on Industrial Application Engineering, (ICIAE2016), Beppu, Oita, Japan, March 25, 2016.
[A71]   Chung-Hao Cheng, Ming-Feng Wu, Chin-Tien Huang, Kuo-Shen Chen, “Load-cell Based Smart Floor Panel for Indoor Localization Applications,” 4th IIAE International Conference on Industrial Application Engineering, (ICIAE2016), Beppu, Oita, Japan, March 25, 2016. (Best Presentation)
[A70]   K-S Chen et al, Thermo-Mechanical Analysis of Laser Peeling of Ultrathin Glass for Removing Edge Flaws in Web Processing Applications, DTIP 2016 (Budapest, May 28-June 02, 2016)
[A69]  T. H. Li and K-S Chen, A Wiimote 3D Localization Scheme without Channel Constraints, Mechatronics 2015, Warsaw, Poland, Sep. 2015. (6次)
[A68]   S. Vechet, J. Kresja, and K-S Chen, “Enhancement of Autonomous Robot Navigation via Sensor Failure Detection,” Mechatronics 2015, Warsaw, Poland, Sep. 2015.
[A67]   R-C Hong, J-F Chuang, and Kuo-Shen Chen, “Thermo-mechanical analysis and characterization of laser glass processing”第七屆兩岸實驗力學研討會, Jul. 2015, 重慶大學, 重慶市.
[A66]   K-S Ou and K-S Chen, “Electromechanical Coupling Characteristics of MEMS Micro Cantilevers with Applications,” DTIP 2015, Montpellier France, April 2015.
[A65]   H. H. Huang and K-S Chen, DESIGN OF A NOVEL PVDF-BASED PIEZOELECTRIC ENERGY HARVESTER WITH BEATING MECHANISMS, 4th International Engineering Symposium - IES 2015, March 4-6, 2015, Kumamoto University, Japan.
[A64]   Y-C Teng and K-S Chen, “Design, Analysis, and Control of an Elastomeric Bearing Positioning Stage,”6^th International Conference on Positioning Technology, Kitakyushu, Japan, Nov. 2014. (Best Paper)
[A63]   K-S Chen, DESIGN, ANALYSIS, AND EXPERIMENTAL STUDIES OF A NOVEL PVDF-BASED PIEZOELECTRIC ENERGY HARVESTER WITH BEATING MECHANISMS,ASME 2014, International Mechanical Engineering Congress and Exposition (IMECE 2014), Montreal Canada. (3次)
[A62]   C. Chung, R. Hong, K-S Chen, and C-C Chen, “The Investigation of Buckling, Def0Rmation and Interaction of Elastic Films for Touch Panel Applications,” in Proc. 9th International Microsystems, Packaging, Assembly, Circuits Technology (IMPACT 2014), Taipei, Taiwan, Oct. 2014.
[A61]   Y. G. Tsai, K-S Chen, and T-H Yang, “Stress analysis and characterization of PECVD oxide/nitride multi-layered films after thermal cycling,” ACMFMS2014, Nara, Japan, Oct. 2014.               
[A60]   林佩君, 陳國聲, 鄭晏鋒      雙軸式材料測試系統之設計與實現及其在橡膠軸承之應用, 第六屆兩岸實驗力學研討會, Sep. 2014, 台中中興大學.
[A59]   C. Chung, R. Hong, K-S Chen, and C-C Chen, “Buckling Analysis for a Rectangular Membrane for Touch Panel Applications,” in Proc. 15th International Conference on Electronic Packaging Technology (ICEPT 2014), Chengdu China, Aug. 2014. 
[A58]   Y. G. Tsai and K. S. Chen, “Modeling and Experimental Validations on Residual Stress Evolution of PECVD Films During Rapid Thermal Annealing, 16th International Conference on Experimental Mechanics (ICEM16), July 07-10, 2014, Cambridge, UK.
[A57]   Y. T. Fu and K. S. Chen, “A Novel Indoor Localization Scheme by Integrating Wiimote Sensing and A Controllable IR-LED Array,” In Proc. Mechatronics 2013, pp. 567-574, Brno, Czech Republic, Oct, 2013. 
[A56]   VĚCHET, S.; CHEN, K.; KREJSA, J. Hybrid Navigation Method for Dynamic Indoor Environment Based on Mixed Potential Fields. In Recent Technological and Scientific Advances. 2013. p. 575-582. 
[A55]   K-S Chen and S. L. Wu “Modeling of Chemical Mechanical Polishing Processes by Cellular Automata and Finite Element/Matlab Integration Methods” Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS - DTIP’13- Barcelona, Spain 16-18 April 2013
[A54]   J. W. Lee, K-S Chen, and Y. H. Liu, “Design, Analysis, and Control of a Cascaded Piezoelectric Actuated Two-Degrees-of-Freedom Precision Stage” 3rd International Engineering Symposium - IES 2013, March 4-6, 2013, Kumamoto University, Japan
[A53]   Chia-Hsing Pi, Ming-Fong Wu, and Kuo-Shen Chen, “Touch Sensing Design based on Strain and F0Rce Measurements”第五屆兩岸實驗力學研討會, Aug. 2012, 昆明.
[A52]   M. H. Chen, Y. T. Fu, K-S Ou, and K-S Chen, “On the Development of Autonomously Manipulation of Group Mobile Robots f0R Smart Living and Biomimetic Applications,” 2012 IEEE International Conference on Computer Science and Automation Engineering (CSAE 2012), Hunan, China, May 2012. (3次)
[A51]   D. Gu, Y. T. Fu, K-S Ou, and K-S Chen, “Design of Wiimote Indoor Localization Technology for Omni-directional Vehicle Trajectory Control” 2012 IEEE International Conference on Computer Science and Automation Engineering (CSAE 2012), Hunan, China, May 2012. 
[A50]   D. Gu, Y-D Fu, K-S Ou, and K-S Chen, "Wiimote-based indoor localization for smart living space applications,"6th Japan-Taiwan W0Rkshop on Mechanical and Aerospace Engineering, Sapp0Ro, Japan, Dec. 7-10, 2011
[A49]    A. Barton-Martinelli, D. Cuff, K-S Chen, and D. L. Trumper, "Design and Realization of a Novel Elastomer Mechanical Properties Characterization System" ASPE 2011 Annual Meeting, Nov. 2011, Denver, CO, USA (Accepted).
[A48]    D. Gu, P.-W. Chen, K.-S. Ou, Y.-D. Fu, and K.-S. Chen “Design and Performance Evaluation of Wiimote-Based Two-Dimensional Indoor Localization Systems,” Automation 2011, The 11th International Conference on Automation Technology, Yunlin, Taiwan, Nov. 2011
[A47]    Y. H. Liu, C. M. Chao, C. T. Lu, and K-S Chen, "Vibration control on single axis flexible piezoelectric positioning stage by PID controller", the 5th International Symposium on Environmental Vibrations (ISEV 2011), Oct 20-22, Chengdu, China, 2011.
[A46]    M.-H. Chen, D. Gu, Y.-D. Fu, C.-H.Pi, K.-S.Ou, and K.-S. Chen, "Wireless Group Manipulation of Autonomously Guided Mobile Robots f0R Smart Living Space Applications",Proc. SICE 2011, 50th Annual Conf. of the Society of Instrument and Control Engineers of Japan, pp. 2143-2148, Sep. 2011, Tokyo, Japan. (4次)
[A45]    C-H Pi, K-S Ou, M-H Chen, and K-S Chen, "Analysis, Simulation, and Experimental Investigations of a One Dimensional Touch Panel Based on Strain Sensing" Proc. SICE 2011, 50th Annual Conf. of the Society of Instrument and Control Engineers of Japan, pp. 1954-1959, Sep. 2011, Tokyo, Japan. (2次)
[A44]   Z-K Huang, K-S Ou, and K-S Chen, “Nanoindentation Characterization of PECVD Silicon Nitride on Silicon Subjected to Mechanical Fatigue Loading,” MRS Fall Meeting, Boston, MA, USA, Nov. 29-Dec. 03, 2010. 
[A43]   P-W Chen, K-S Ou, and K-S Chen, “IR indoor localization and wireless transmission for motion control in smart building applications based on Wiimote technology,” Proc. SICE 2010, 49^th Annual Conf. of the Society of Instrument and Control Engineers of Japan, pp. 1781-5, 2010 
[A42]   I-K Lin, P-H Wu, K-S Ou, K-S Chen, X. Zhang, "The Tunability in Mechanical Properties and Fracture Toughness of Sputtered Silicon Oxynitride Thin Films for MEMS-based Infrared Detectors" MRS Fall Meeting, Boston, MA, USA, Nov. 30-Dec. 04, 2009. (2次)
[A41]   K-S Ou, I-K Lin, P-H Wu, Zhi-Kai Huang, K-S Chen, X. Zhang, "Mechanical Characterization of Atomic Layer Deposited (ALD) Alumina for Applications in C0Rrosive Environments," MRS Fall Meeting, Boston, MA, USA, Nov. 30-Dec. 04, 2009. (3 次)
[A40]   I-K Lin, K-S Ou, K-S Chen, X. Zhang, "Cellular F0Rce Measurement in Cardiac Myocytes Using Polymer Micropillar Array with Viscoelastic Characterization," Micro TAS 2009, Jeju, Korea, Nov. 2009. 
[A39]   K-S Ou, K-S Chen, T-S Yang, and S-Y Lee, "A Novel Semi-Analytical Approach f0R Micro Beams Subjected to Electrostatic Loads and Residual Stress Gradients," ASME IDETC 2009, Aug 30-Sep. 3, 2009 San Diego, CA, USA. (3次)
[A38]   歐廣順, 林奕寬, 陳國聲, "PDMS 黏彈性質檢測與其在細胞力學上之應用," 第三屆海峽兩岸實驗力學研討會, 呼和浩特, 內蒙古July 2009.
[A37]   K-S Chen and K-S Ou, "Fast Positioning and Impact Minimizing of MEMS Devices by Suppression Motion-Induced Vibration by Command Shaping Method," MEMS 2009 Jan 25-29, S0Rrento, Italy.
[A36]   Yang, T.-S., Wang, Y.-C., Chen, K.-S., Chen, Y.-C. & Yen, J.-L. (November 2008) Optimization of wafer-back pressure profile in chemical mechanical planarization. Presented at the 2008 Annual Meeting of the Division of Fluid Dynamics, American Physical Society, November 23-25, 2008, San Antonio, Texas, USA. (5次)
[A35]   I-K Lin, Y-M Liao, Y. Liu, K-S Ou, K-S Chen, and X. Zhang, "Elastic and Viscoelastic Characterization and Modeling of Polymer based Structures for Biological Applications," ASME IMECE 2008, Nov. 2008 Boston, MA, USA. (Best Paper award)
[A34]   I-L Lin, Y-M Liao, K-S Chen, and X. Zhang, "Viscoelastic Characterization of Soft Micropillars for Cellular Mechanics Study," MicroTAS 2008, San Diego, Oct. 2008. 
[A33]   I-K Lin, Y-M Liao, Y. Liu, K-S Ou, K-S Chen, and X. Zhang, "Elastic and Viscoelastic Characterization of Polydimethylsiloxane (PDMS) f0R Biological Applications," Hilton Head Conference 2008, June 01-05, 2008.
[A32]   H-M Yeh and Kuo-Shen Chen, "Development of Device-Level Chemical-Mechanical Polishing Simulation Module," 4th APCOT, June23-25, 2008, Tainan, Taiwan.
[A31]   Y-M Liao, I-K Lin, K-S Ou, K-S Chen, and Xin Zhang, "Elastic and Viscoelastic Characterization of Polydimethylsiloxane (PDMS) f0R Biological Applications," 4th APCOT, June 23-25, 2008, Tainan, Taiwan.
[A30]   H-Y Yan, K-S Ou, and K-S Chen, “Indentation Characterization of Fracture Toughness and Interfacial Strength of PECVD Nitrides after Rapid Thermal Annealing” Materials Research Society Fall Meeting, Boston, MA, Nov. 2007.
[A29]   I-K Lin, Y-M Liao, K-S Chen, and X. Zhang, “Elastic and Viscoelastic Characterization of Polydimethylsiloxane (PDMS) for Cell-Mechanics Applications” Materials Research Society Fall Meeting, Boston, MA, Nov. 2007. 
[A28]   K.-S. Ou, H.-Y. Yan, K.-S. Chen,"Mechanical Characterization of KMPR by Nanoindentation for MEMS Applications," ICEM13, Greece, July 2007.
[A27]   H.-Y. Yan, K.-S. Ou, K.-S. Chen,"Mechanical Properties Measurement of PECVD silicon Nitride After Rapid Thermal Annealing Using Nanoindentation Technique", ICEM13, Greece, July 2007.
[A26]   K.S. Chen, T.Y. Chen, H.Y. Yan, I.T. Huang, J.K. Chen, "Mechanical Properties Characteristics of Rubber O-Rings by Digital Image C0Rrelation and Nanoindentation," 2007 SEM Annual Conference & Exposition, Springfield, MA, USA. June3-6, 2007.
[A25]   Hsiu-Ming Yeh, Kuo-Shen Chen, and I-Kuan Lin, "Development of Electron Beam Lithography 3D Fabrication Emulat0R: A Current Status Rep0Rt", Proc. Symposium on Nano Device Technology (SNDT) April 28, 2006 Hsinchu, Taiwan
[A24]   K.-S. Ou, K.-S. Chen, and J. Shieh, "Characterization of Dynamic Characteristics of RF MEMS Switches: Current Progress and Future Perspective" Proc. Symposium on Nano Device Technology (SNDT) April 28, 2006 Hsinchu, Taiwan
[A23]   K-S Chen, Residual Vibration Suppression f0R Duffing Nonlinear Systems with Electromagnetically Actuation Using Nonlinear Input Shaping Techniques, Presented in the 1st Cross-Strait Experimental Mechanics W0Rkshop, Aug.01-3, 2005 Beijing, China.
[A22]   Y-Y Wang and K-S Chen, "Probablistic Fatigue Test f0R MEMS Materials: Conceptural Design and Current Progress"Proc. Symposium on Nano Device Technology (SNDT) May 04, 2005. Hsinchu, Taiwan.
[A21]   I-K Lin, K-S Chen, and F-H Ko, “Modeling f0R SU-8 Struuctures Fabricated by Electron Beam Lithography,” Proc. Symposium on Nano Device Technology (SNDT), May 11, 2004, pp. 301-304.
[A20]   K-S Chen, T. Y. Chen, J-C Chuang, and I-K Lin, “Full- Field Wafer Level Thin Film Stress Measurement By Phase-Stepping Shadow M0Rie,” ICEM12- 12th International Conference on Experimental Mechanics, 29 August - 2 September, 2004 Politecnico di Bari, Italy
[A19]   J-K Chen, I-K Lin, F-H Ko, F-C Chang, and K-S Chen, “Plasma Resistance and Behavi0R of Polybenzoxazine Polymer,” 2003 International Microprocess and Nanotechnology Conference, Oct. 2003, Japan.
[A18]   K-S Chen, K-S Ou, C-H Cheng, R-F Hsu, Y-M Yeh, and T. Y. Chen, "An Improved Wafer Curvature to Film Stress Conversion f0R Residual Stress Measurements", International Symposium on Experimental Mechanics, Taipei, Taiwan, Dec. 2002. (NSC90-2212-E-006-054)
[A17]   X. Zhang, K-S Chen, S. M. Spearing, “Residual Stress and Fracture of Thick Dielectric Films f0R Power MEMS Applications,” 15^th IEEE International Micro Electro Mechanical Systems Conference (MEMS02), Jan 2002 . (NSC89-2212-E-006-093) 
[A16]   K-S Chen, “On the Unification of Material Strength Testing f0R MEMS Applications,” Material Research Society Meeting, Nov. 2001, Boston, MA. . (NSC90-2212-E-006-055) (1次)
[A15]   K-S Chen, X. Zhang, S. M. Spearing, “Processing of Thick Dielectric Films f0R Power MEMS: Stress and Fracture,” Material Research Society Meeting, Nov. 2000, Boston, MA. (NSC89-2212-E-006-093) 
[A14]   X. Zhang, R. Ghodssi, K-S Chen, A. A. Ayon, and S. M. Spearing, “Residual Stress Characterization of Thick PECVD TEOS Film f0R Power MEMS Application,” Proceeding of 2000 Solid-State Sens0R and Actuat0R W0Rkshop, June 4, 2000, Hilton Head, SC, pp. 316-319. (NSC89-2212-E-006-093) 
[A13]   N. Hagood IV, D. Roberts, L. Saggere, K. Breuer, K-S Chen, J. Carretero, H. Li, R. Mlcak, S. Pulitzer, M. Schmidt, S. Spearing, and Y. H. Su, “Micro Hydraulic Transducer Technology f0R Actuation and Power Generation,” Proceedings of SPIE V3985, pp. 680-688, 2000. 
[A12]   N. Hagood IV, D. Roberts, M. Schmidt, S. Spearing, K. Breuer, R. Mlcak, J. Carretero, F. Ganji, H. Li, K-S Chen, Y. Su, and S. Pulitzer "Development of Micro Hydraulic Transducer Technology", ICAST '99 (International Conference on Adaptive Structures and Technologies) Paris, France, October 11-13,1999. 
[A11]   R. Ghodssi, X. Zhang, K-S Chen, K. A. Lohner, S. M. Spearing, and M. A. Schmidt, “Residual Stress Characterization of Thick PECVD Oxide Films f0R MEMS Applications,” American Vacuum Society 46^th International Symposium, Seattle, WA, USA, Oct. 1999.
[A10]   Kuo-Shen Chen, S. Mark Spearing, Noel N. Nemeth, “Structural Design of a Silicon Micro Turbo Generat0R,”AIAA-99-1332, Proceedings of the 1999 40^th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, April, 1999, pp. 1144-1153.
[A9]     Kuo-Shen Chen, Arturo A. Ayon, Kevin A. Lohner, Mark A. Kepets, Terran K. Melconian, S. Mark Spearing, “Dependence of Silicon Fracture Strength and Surface M0Rphology on Deep Reactive Ion Etching Parameters,” MRS Fall Meeting, Mat. Res. Soc. Symp. Proc. 546, 21-26, 1999. 
[A8]     A. A. Ayón, K.-S Chen, K. A. Lohner, S. M. Spearing, H. H. Sawin and M. A. Schmidt, “Deep Reactive Ion Etching of Silicon,” Mat. Res. Soc. Symp. Proc. 546, 1999. 
[A7]     Kevin A. Lohner, Kuo-Shen Chen, Arturo A. Ayon, S. Mark Spearing, “Microfabricated Silicon Carbide Microengine Structures,” Mat. Res. Soc. Symp. Proc. 546, 85-90, 1999*
[A6]     K-S Chen, A. A. Ayon, S. M. Spearing, "Silicon Strength Testing f0R Mesoscale Structural Applications," MRS Spring Meeting, MRS Symposium Proceeding Vol. 518, pp. 123-130, 1998.
[A5]     Epstein, A. H., S.D. Senturia, G. Anathasuresh, A. Ayon, K. Breuer, K-S Chen, F. E. Ehrich, G. Gauba, R. Ghodssi, C. Grosherny, S. Jacobson, J.H. Lang, C-C Lin, A Merha, J.M. Miranda, S. Nagle, D.J. 0Rr, E. Piekos, M.A. Schmidt, G. Shirley, M.S. Spearing, C.S. Tan, Y-S Tzeng, I.A. Waitz: "Power MEMS and Microengines," IEEE Transducers '97 Conference, Chicago, IL, June 1997. 
[A4]     Epstein, A. H, S.D. Senturia, O. Al-Midani, G. Anathasuresh, A. Ayon, K. Breuer, K-S Chen, F.F. Ehrich, E. Esteve, L. Frechette, G. Gauba, R. Ghodssi, C. Groshenry, S.A. Jacobson, J.L. Kerrebrock, J.H. Lang, C-C Lin, A. London, J. Lopata, A. Mehra, J.O. Mur Miranda, S. Nagle, D.J. 0Rr, E. Piekos, M.A. Schmidt, G. Shirley, S.M. Spearing, C.S. Tan, Y-S Tzeng, I.A. Waitz, Micro-Heat Engines, Gas Turbines, and Rocket Engines - the MIT Microengine Project,” 28th AIAA Fluid Dynamics and 4th AIAA Shear Flow Control  Conference, June 1997. 
[A3]     K-S Chen, A. Montero, D. L. Trumper, S. Smith, and M.E. Williams, " Spring Dominated Regime Design of a High Load Capacity, Electromagnetically Driven X-Y-qStage," Proceeding of 10^th ASPE Annual Conference, Austin, Texas, Oct. 1995.
[A2]     M. K. Hor, J. Y. M. Chen, and K-S Chen, “Wavelet Transf0Rm in Depth Recovery,” Proceedings of SPIE International Symposium on Intelligent Robotic Systems, Boston, Mass., September 1993. 
[A1]          M. K. Hor, K-S Chen, and J. Y. M. Chen, “On the Integration of An Experimental Hand-Eye Robot System,” The First Chinese W0Rld Congress on Intelligent Control and Intelligent Automation, Beijin, China, August 1993.

1. A 智慧型建築體 中華民國 I398569 , 2013/07-2029/11
2. A 多波段加速規,中華民國 I716139,  (2021/0-2039/10).