首頁 / 成員介紹 / 專任教師
專任教師
黃聖杰Sheng-Jye Hwang
職  稱
教授
學  歷
美國伊利諾大學香檳分校 機械所 博士
電  話
教授室(62184)、實驗室(62136-21)
研 究 室
教授室(91718室)、實驗室(91905室)
網  頁
專  長
機械固力、機械熱流、高分子、自動化
簡要經歷
  1. 國立成功大學工學院機械工廠主任

  2. 國立成功大學機械系副主任

  3. 國立成功大學機械科技研發中心主任

  4. IMAPS 常務理事

  5. 中部科學園區研發精進產學合作計畫審查委員

  6. 台灣區電腦輔助成型技術交流協會(ACMT)副理事長

  7. 國際CAE模具成型技術研討會CMSA副主席(2010~2014)

  8. 多項期刊reviewer

著作發表

專書及專書論文

001.

Hwang, S.-J. and C.L. Tucker III, “A Model for the Diaphragm Forming Process,” Ph.D. Thesis, Mechanical and industrial Engineering Department, University of Illinois at Urbana-Champaign (1992).

002.

Hwang, S.-J. and C.L. Tucker III, “A Model for the Diaphragm Forming Process of Continuous Fiber Reinforced Thermoplastic Composites,”Report to General Dynamics Corporation (1990).

003.

Hwang, S.-J.,“Heat Transfer Analysis of Advanced Thermoplastic Composites During Forming,”M.S. Thesis, Department of Mechanical Engineering, University of Illinois at Urbana-Champaign (1990).

004.

黃聖杰, “模擬熱塑性高等複合材料熱壓成形(理論部份),”國科會計劃報告(1994).

005.

黃聖杰, “模擬熱塑性高等複合材料壓模成形(數值分析部份),”國科會計劃報告(1995).

006.

黃聖杰, “以黏彈力學分析塑膠成型件的殘留應力,”國科會報告(1996).

007.

蘇厚合,黃聖杰, 林珮玲“Pro/ENGINEER 2000i快速入門手冊”碁峰出版社,台北(1999).

ISBN:88015650

008

張沛頎,裴建昌,黃聖杰“Pro/ENGINEER 2000i進階攻略” 碁峰出版社,台北(2000).

009

王俊祥,黃聖杰“Pro/NC三軸銑床加工秘笈” 全華出版社,台北(2000).

ISBN:9572129139

010

張益三,黃聖杰“Pro/E入門基礎功能剖析” 全華出版社,台北(2000).

ISBN:9572129430

011

張益三,黃聖杰“Pro/E入門基礎實例演練” 全華出版社,台北(2000).

ISBN:9572129422

012

蘇厚合,黃俊賢,黃聖杰, ”Pro/ENGINEER 2000i2入門導引”碁峰出版社,台北(2000).

ISBN:9575667778

013

張益三,洪立群,張祥傑, 黃聖杰, “Pro/ENGINEER 2000i2進階剖析(上)” 知城出版社,台北(2001).

ISBN:9572005189

014

張益三,洪立群,張祥傑, 黃聖杰, “Pro/ENGINEER 2000i2進階剖析(下)” 知城出版社,台北(2001).

ISBN:9572005197

015

蘇厚合,黃俊賢,黃聖杰, “Pro/ENGINEER 2001入門導引(上)” 碁峰出版社,台北(2001).

ISBN:9575669258

016

張沛頎, 裴建昌, 黃聖杰, “Pro/ENGINEER 2001進階攻略” 碁峰出版社,台北(2001).

ISBN:9575669606

017

張益三, 張智仁, 黃聖杰, “Pro/ENGINEER 2001基礎入門即學即用篇” 知城數位,台北(2001).

018

張益三, 張智仁, 黃聖杰, “Pro/ENGINEER 2001基礎入門實力養成篇” 知城數位,台北(2001).

019

張祥傑, 黃聖杰, “Pro/ENGINEER 2001 模具設計” 知城出版社, 台北(2002).

ISBN:9570080477

020

王俊祥, 黃聖杰, “實戰Pro/ENGINEER 2001 NC入門寶典” 知城出版社, 台北(2002).

ISBN:9572005715

021

洪立群, 翁志傑, 黃聖杰, “實戰Pro/ENGINEER 工程圖” 知城出版社,台北(2002).

ISBN:9867845005

022

黃聖杰, 張益三, “實戰Pro/ENGINEER 曲面設計” 知城出版社,台北(2002).

ISBN:9867845285

023

黃聖杰, 林俊宏, 蔡政霖, “實戰Pro/ENGINEER 鈑金設計” 知城出版社,台北(2002).

ISBN:9867845137

024

張沛頎, 裴建昌, 黃聖杰, “Pro/Engineer Wildfire進階設計”碁峰出版社,台北(2003).

ISBN:9864214055

025

鄧湘榆, 張沛頎, 裴建昌, 黃聖杰, “Pro/Engineer Wildfire輕鬆入門”碁峰出版社,台北(2003).

ISBN:9864216481

026

林勇志, 黃朝瑜, 黃聖杰, “Pro/ENGINEER Wildfire基礎入門(上)”知城數位,台北(2003).

ISBN:9867845854

027

洪立群, 黃聖杰, “實戰Pro/ENGINEER Wildfire工程圖”知城出版社,台北(2003).

028

李文宏, 王耀德, 黃聖杰, “實戰Pro/ENGINEER Wildfire鈑金設計”知城出版社,台北(2003).

029

張祥傑, 黃聖杰, “實戰Pro/ENGINEER Wildfire模具設計” 知城出版社,台北(2004).

ISBN:9867489020

030

張益三, 黃聖杰, “實戰Pro/ENGINEER Wildfire 曲面設計” 知城出版社,台北(2004).

031

林勇志, 黃朝瑜, 黃聖杰, “Pro/ENGINEER Wildfire基礎入門(下)”知城數位,台北(2004).

032

張益三, 黃聖杰, “實戰Pro/ENGINEER Wildfire 2.0 基礎入門(上)” 知城出版社,台北(2005).

ISBN:9867231066

033

張益三, 黃聖杰, “實戰Pro/ENGINEER Wildfire 2.0 基礎入門(下)” 知城出版社,台北(2005).

034

陳暉長, 林資濱, 黃聖杰, “實戰Pro/ENGINEER Wildfire 2.0 鈑金設計” 知城出版社,台北(2005).

ISBN:9867231015

035

張祥傑, 黃聖杰, “實戰Pro/ENGINEER Wildfire 2.0模具設計” 知城出版社,台北(2005).

ISBN:

036.

張益三, 黃聖杰, “實戰Pro/ENGINEER Wildfire 2.0 機構運動模擬” 知城出版社,台北(2005).

ISBN:9867231244

037

鄧湘榆, 黃昭霖, 黃進財, 黃聖杰, “Pro/ENGINEER Wildfire 3.0 基礎入門,” 碁峯出版社,台北(2007).

ISBN:9789861811444

038

鄧湘榆, 薛啟宏, 范家瑞, 黃聖杰, “Pro/ENGINEER Wildfire 3.0 工程應用,” 碁峯出版社,台北(2007).

ISBN:9789861811451

039

鄧湘榆, 張智傑, 陳皇仁, 黃聖杰, “Pro/ENGINEER Wildfire 3.0 鈑金設計,” 碁峯出版社,台北(2007).

ISBN:9789861811468

040.

張益三, 黃聖杰, “Pro/ENGINEER Wildfire 3.0 進階設計,” 碁峯出版社,台北(2007).

ISBN:9789861812502

期刊論文

001.

Hwang, S.-J.and C. L. Tucker III. “Heat Transfer Analysis of Continuous Fiber /Thermoplastic Matrix Composite During Manufacturing,”J. of Thermoplastic Composite Materials3, 41-45 (1990).

002.

黃聖杰, “3C產業未來發展不可或缺的主角—鎂合金,” 工業材料144期, 73-75 (1998).

003.

黃聖杰, 李輝煌, 黃登淵, 林秋吉, “聚苯乙烯材料兩階段射出成型固液界面結合強度之理論預估與實驗探討,” 技術學刊Journal of Technology14, No. 1, 49-54(1999).

004.

李輝煌, 黃聖杰, 黃登淵, 楊秉茂, “PMMA壓克力材料兩階段射出成型固液界面結強度與破裂之研究,” 高雄科學技術學院學報(第27期), p113-130, December (1997).

005.

Su, Francis, Sheng-Jye Hwang, Huei-Huang Lee and Durn-Yuan Huang, “Prediction of Paddle Shift via 3D TSOP Modeling,” IEEE Transaction on Components and Packaging Technology, 23, p684-692(2000).

006

張沛頎,黃登淵,李輝煌,黃聖杰, “基因治療用微針設計與塑料成型,” 機械工業, p131-140 (2001).

007

Chen, Tei-Chen, Sheng-Jye Hwang and Chang-Qua Chen, “Nonlinear Time-Dependent Thermoelastic Response in a Multilayered Anisotropic Medium,” ASME Journal of Applied Mechanics69, p556-563 (2002).

008

張智仁,黃聖杰, “利用快速原型系統製作快速模具,” 機械月刊319, p211-220 (2002).

009

林勇志, 黃聖杰, “探討IGES檔輸入CAE軟體ANSYS及修補技巧”, CADesigner174, (2002).

010

Chang, Yi-San, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, “Study of P-V-T-C Relation of EMC,” ASME Journal of Electronic Packaging, 124, p371-373 (2002).

011

Su, Jerry, Sheng-Jye Hwang, Francis Su and Shou-Kang Chen, "An Efficient Solution f0R Wire Sweep Analysis in IC Packaging,” ASME Journal of Electronic Packaging125, p139-143 (2003).

012

Lee, Hung-Lung, Shyang-Jye Chang, Sheng-Jye Hwang, Francis Su, and Shou Kang Chen, “Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance,” ASME Journal of Electronic Packaging125, p268-275 (2003).

013

Chang, Shyang-Jye and Sheng-Jye Hwang, “Design and Fabrication of an IC Encapsulation Mold Adhesion F0Rce Tester,” IEEE Transactions on Electronics Packaging Manufacturing, 26, p281-285(2003).

014

Chang, Rong-Yeu, Wen-Hsien Yang, Sheng-Jye Hwang and Francis Su, “Three Dimensional Modeling of Mold Filling in Microelectronics Encapsulation Process,” IEEE Transactions on Components and Packaging Technologies27, p200-209 (2004).

015

Hong, Li-Ching and Sheng-Jye Hwang, “Study of Warpage Due to P-V-T-C Relation of EMC in IC Packaging,” IEEE Transactions on Components and Packaging Technologies27, p291-295 (2004).

016

Lin, Yeong-Jyh and Sheng-Jye Hwang, “Temperature Prediction of Rolling Tires by 3D Dynamic Simulation,” Mathematics and Computers in Simulation, 67, p235-249(2004).

017

黃聖杰, 裴建昌, “IC封裝技術,”化工技術, 第12卷第1期p2-20 (2004).

018

Lin, Yeong-Jyh and Sheng-Jye Hwang, “Static Analysis of the Die Picking Process,” IEEE Transactions on Electronics Packaging Manufacturing 28, p142-149(2005).

019

Pei, Chien-Chang and Sheng-Jye Hwang, “Three-Dimensional Paddle Shift Modeling f0R IC Packaging,” ASME Journal of Electronic Packaging, 127, p334-344 (2005).

020

Pei, Chien-Chang and Sheng-Jye Hwang, “Prediction of Wire Sweep during the Encapsulation of IC Packaging with Wire Density Effect,” ASME Journal of Electronic Packaging127, p335-339 (2005).

021

Hwang, Sheng-Jye., Y.-S. Chang, “Isobaric Cure Shrinkage Behavi0Rs of Epoxy Molding Compound in Isothermal State,” Journal of Polymer Science Part B: Polymer Physics, 43, p2392-2398 (2005).

022

Chang, Pei-Chi and Sheng-Jye Hwang, "Injection Molding of Microprobe Array Parts," Journal of Polymer Research,13(1): 25-32 FEB(2006).

023

Chang, Pei-Chi and Sheng-Jye Hwang, "Geometry Influence of Reflect0Rs f0R Infrared Rapid Heating in Micro-Injection Molding," Materials Science F0Rum, 505-507, p1261-1266 (2006).

024

Hwang, Sheng-Jye and Yi-San Chang, “P-V-T-C Equation f0R Epoxy Molding Compound,” IEEE Transactions on Components and Packaging Technologies29, p112-117(2006).

025

Chang, Pei-Chi and Sheng-Jye Hwang, "Simulation of Infrared Rapid Surface Heating f0R Injection Molding," International Journal of Heat and Mass Transfer,.49, p3846-3854 (2006).

026

Chang, Pei-Chi and Sheng-Jye Hwang, "Experimental Investigation of Infrared Rapid Surface Heating f0R Injection Molding," Journal of Applied Polymer Science,102(4): p3704-3713 (2006).

027

Chiu, S.M., Sheng-Jye Hwang, C.W. Chu and Dershin Gan, “The Influence of Cr-Based Coating on the Adhesion F0Rce between Epoxy Molding Compounds and IC Encapsulation Mold,” Thin Solid Films, 515, p285-292 (2006).

028

Chang, P.C., Sheng-Jye. Hwang, H. H. Lee and D.Y. Huang, "Design and Verification of a Clamping System f0R Micro-Injection Molding Machine,”Transactions of the Canadian Society f0R Mechanical Engineering,30 (3), p413-428 (2006).

029

Chang, Pei-Chi, Sheng-Jye Hwang, Huei-Huang Lee and Durn-Yuan Huang, “Development of an External-Type Micro Injection Molding Module f0R Thermoplastic Polymer,” Journal of Materials Processing Technology184 (1-3), p163-172 (2007).

030

Teng, Shiang-Yu, Sheng-Jye Hwang, “Simulations of Process-Induced Warpage during IC Encapsulation Process”, ASME Journal of Electronic Packaging129, p307-315 (2007).

031

Teng, Shiang-Yu, Sheng-Jye Hwang, “Predicting the Process Induced Warpage of Electronic Packages Using the P-V-T-C Equation and the Taguchi Method”, Microelectronics Reliability47, p2231-2241 (2007).

032

Teng, Shiang-Yu, Sheng-Jye Hwang, “Simulations and Experiments of Three-Dimensional Paddle Shift f0R IC Packaging”, Microelectronic Engineering, 85, p115-125 (2008).

033

Lin, Chin-Wei, Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang, “Simulation and Design of Multiple-Station Rolling F0Rming f0R U-Section Steel Bar,” Journal of the Chinese Society of Mechanical Engineers29, No.5, pp.429~433 (2008).

034

Liu, Yu-Ting, Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang, “Reduction of Photo Leakage Current of Hydrogenated Am0Rphous Silicon Thin Film Transist0Rs,” Journal of the Chinese Society of Mechanical Engineers29, No.5, pp.373~379 (2008).

035

Chien-Nan, Chen, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, “Application of Dynamic Masking on Rapid Prototyping,” Material Science F0Rum, 594, pp 261-272 (2008).

036

Chen, Hwe-Zhong, Wen-Hung Lee, Huei-Huang Lee, Durn-Yuan Huang,Chang, Shyang-Jye and Sheng-Jye Hwang, “Effects of Defrosting Period on Mold Adhesion F0Rce of Epoxy Molding Compound,” Asia-Pacific Journal of Chemical Engineering, (www.interscience.wiley.com) DOI:10.1002/apj.186, Wiley InterScience(2008)

037

Deng, S-S., C. Ho, H. Lee, S.-J. Hwang and D.-Y Huang, “Volume Shrinkage Characterization of Underfill Materials,” IEEE Transactions on Components, Packaging, and Manufacturing Technologies1, pp.78-82 (2011)

038

林敬銘、黃聖杰、李輝煌、黃登淵,”架空移動式起重機箱形桁架結構強度探討,” 264, pp.40-50,工業安全衛生月刊(2011).

039

Lin, Yeong-Jyh, Sheng-Jye Hwang, Huei-Huang Lee and Durn-Yuan Huang, “Modeling of Viscoelastic Behavi0R of an Epoxy Molding Compound during and after Curing,” IEEE Transactions on Components, Packaging and Manufacturing Technologies,Vol. 1, No. 11, November, pp.1755-1760(2011).

040

Chen, Jian-Yu and Sheng-Jye Hwang, “Investigation of Adhesion Phenomena in TPU Injection Molding Process,” Polymer Engineering and Science, Vol. 52, No. 7, July, pp. 1571-1580 (2012).

041

Huang, Chi-Hua, Sheng-Jye Hwang, Huei-Huang Lee and Durn-Yuan Huang, “Development of Liquid Spray Process in a Rapid Prototyping Machine,” Advanced Materials Research, (www.scientific.net), Vol. 579, pp 365-375 (2012).

042

Huang, Kuang-Jen, Chen-Yu Chen, Sheng-Jye Hwang and Wei-Hsiang Lai, “Effects of compression distribution of PEMFC stacks using ref0Rmate as fuel,” Energy Procedir29, 234-243 (2012).

043

林敬銘、黃聖杰,“架空移動式起重機箱型桁架最佳化設計,” Vol. 20(4), pp 485-498, 勞工安全衛生研究季刊(2012).

044

Lai, Y.B., D.Y. Huang, S.J. Hwang, H.H. Lee and Y.S. Chang,“Design and Development of 0Ral Appliance f0R Obstructive Sleep Apnea,” Applied Mechanics and Materials, Vol. 284-287, pp1540-1546 (2013).

045

Deng, Shang-Shiuan, Sheng-Jye Hwang and Huei-Huang Lee,  “Warpage Prediction and Experiments of Fan-out Wafer Level Package during Encapsulation Process,”IEEE Transactions on Components, Packaging and Manufacturing Technologies, Vol. 3, No. 3, pp. 452-458 (2013).

046

Chen, Jian-Yu and Sheng-Jye Hwang, “Design and Fabrication of an Adhesion F0Rce Tester f0R Injection Moulding Process,” Polymer Testing, Vol. 32, pp. 22-31 (2013).

047

Sung, Yu-Ting, Sheng-Jye Hwang, Huei-Huang Leeand Durn-Yuan Huang, ”Study on Induction Heating Coil f0R Unif0Rm Mold Cavity Surface Heating,” Advances in Mechanical Engineering, Vol.2014, Article ID 349078 (2014).

048

Bui, Huy-Tien and Sheng-Jye Hwang, “Design of an induction heating coil coupled with magnetic flux concentrat0Rs f0R barrel heating of an injection molding machine,” Proceedings of the Institution of Mechanical Engineers, Part C, Journal of Mechanical Engineering Science, June (2014).

049

Sung, Yu-Ting and Sheng-Jye Hwang, “Design of an 1NSERT Type Induction Heating and Cooling System f0R Injection Molding Processes,” Technical Gazette, Vol. 21, No. 3, pp. 651-656 (2014). http://hrcak.srce.hr/index.php?show=clanak&id_clanak_jezik=182212

050

Chuang, Yu-Siang and Sheng-Jye Hwang, “Effect of Nb2O5 and SWCNT on the H2 S0Rption Properties of Mg-based Hydrogen St0Rage System,”Journal of the Chinese Society of Mechanical Engineers, Vol. 35, No. 4, pp. 327-332 (2014).

051

Su, Siou-Sheng, Sheng-Jye Hwang and Wei-Hsiang Lai, “On a p0Rous medium combust0R f0R hydrogen flame stabilization and operation,” International Journal of Hydrogen Energy, Vol. 39, Issue 36, pp. 21307–21316 (2014). http://www.sciencedirect.com/science/article/pii/S0360319914028997